Packaging Module Development Engineer

Job Title

Packaging Module Development Engineer

Role Summary

Work on Assembly Technology Development (ATD) to develop and scale semiconductor packaging technologies (FLI, SLI, MLI, thermal, SMT/PCB metrology) for high-volume manufacturing. Collaborate with cross-functional teams to improve quality, reliability, yield, cost, and manufacturability.

Experience Level

Mid-level. See Education Requirements for degree-specific years of relevant experience.

Responsibilities

Primary duties include development, characterization, and manufacturing transfer of package assembly and metrology solutions.

• Develop interconnect and thermal assembly solutions (FLI, SLI, MLI) and SMT/PCB metrology for advanced packaging platforms.
• Design and execute process development and equipment characterization using SPC and DOE.
• Optimize assembly processes for quality, reliability, yield, cost, productivity, and manufacturability.
• Drive materials, equipment, and fabrication innovations to meet product and manufacturing goals.
• Manage technical projects to meet product development timelines and transfer to high-volume manufacturing.
• Provide sustaining support for equipment performance and process health in production environments.
• Collaborate with suppliers and cross-organizational teams to meet material specifications and quality requirements.
• Identify and mitigate package quality and reliability risks using analytical and experimental techniques.

Requirements

Must-have technical skills and experience; preferred items listed separately.

• Proven expertise in metrology solutions for semiconductor assembly and packaging technologies.
• Proficiency in Statistical Process Control (SPC) and Design of Experiments (DOE).
• Experience in process development and equipment characterization for assembly technologies.
• Demonstrated ability to manage technical projects and meet time-critical deliverables.
• Experience providing sustaining support in high-volume manufacturing environments.
• Strong communication, analytical, and cross-functional collaboration skills.

Preferred:

• Knowledge of packaging fundamentals, quality and reliability standards, and redistribution layers (RDL).
• Familiarity with semiconductor fabrication processes, assembly materials, and supplier engagement.
• Previous experience in a semiconductor foundry or similar technology-development environment.

Education Requirements

Required: Bachelor's (BS) in Materials Science, Mechanical Engineering, Electrical Engineering, Physics/Applied Physics, or related STEM field with 4+ years relevant experience; OR Master's (MS) in those fields with 3+ years; OR PhD in those fields with 1+ years. Relevant experience may include schoolwork, projects, internships, or military experience. (This summarizes the degree, field, and years requirements stated in the posting.)

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.