Packaging Module Development Engineer

Job Title

Packaging Module Development Engineer

Role Summary

Develop process flows, assembly equipment, and test methods for semiconductor package modules to meet quality, reliability, cost, yield, productivity and manufacturability targets. Work with cross-functional packaging technology, supplier quality and procurement teams to qualify materials, improve processes, and support product qualification.

Deliver experimental design, data analysis, and equipment-based evaluations of package reliability under simulated field conditions; lead problem solving and continuous process improvement to enable product milestones.

Experience Level

Entry-level / Early career. Typical experience range referenced in the posting is approximately 1–3+ years depending on degree (see Education Requirements).

Responsibilities

Key responsibilities include developing, qualifying, and improving packaging assembly processes, equipment, and reliability evaluations.

• Develop and optimize assembly processes and equipment for package manufacturing to meet quality, reliability, cost, yield and manufacturability targets.
• Design and run experiments using DOE and SPC methods; analyze data and document results.
• Develop and maintain test equipment and methods to evaluate package behavior under heat, humidity, temperature cycling and mechanical stress.
• Ensure manufacturability of package physical layouts and oversee process flows and procedures through production cycles.
• Establish material specifications for contract assemblers and vendors and work with supplier quality and procurement to enforce requirements.
• Develop techniques, acceleration methods and screens to identify packaging quality and reliability issues early.
• Set reliability requirements and influence design, material selection and process development based on failure-mechanism understanding.
• Provide packaging consultation, respond to customer/client requests or events, and drive standardization of qualification and manufacturing quality methods.
• Regular onsite presence is required to fulfill essential job responsibilities.

Requirements

Must-have technical skills and experience; preferred items noted separately.

• Practical experience with Statistical Process Control (SPC) and Design of Experiments (DOE).
• Strong experimental background with hands-on laboratory or prototype development experience.
• Programming/scripting experience (examples: Python, MATLAB) and familiarity with AI/ML concepts applied to process or data analysis.
• Experience with reliability testing methods and environmental stress tests (thermal, humidity, mechanical).
• Ability to specify materials and work with vendor/supplier quality to meet process specifications.
• Experience applying statistical methods for process development, problem solving and continuous improvement.
• Excellent written documentation and the ability to produce technical reports/white papers.
• Nice-to-have: prior semiconductor or advanced manufacturing packaging experience and equipment development for assembly/test.

Education Requirements

Required: Master's degree in Mechanical Engineering, Materials Science, Electrical Engineering, Physics/Applied Physics, or a related STEM field with 3+ years of industry experience; OR PhD in those fields with 1+ years of industry experience. Minimum cumulative GPA of 3.5. Relevant experience may come from schoolwork, projects, internships, or military service. Must hold the required degree prior to start.

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.