Packaging Module Development Engineer

Job Title

Packaging Module Development Engineer

Role Summary

Process and technology development engineer focused on solder ball attach, chip attach and related assembly processes within the CAM/SLAM technology development organization. Work includes pathfinding, developing, qualifying and ramping materials and processes for new products (NPI), shuttle programs, test vehicles and foundry products.

Role requires on-site presence in Kulim and close collaboration with cross-functional teams to meet quality, reliability, cost, yield and manufacturability goals.

Experience Level

Entry-level / College graduate. Candidates with less than one year of relevant experience are acceptable; research-focused graduate experience (MSc/PhD) is preferred.

Responsibilities

Primary responsibilities include process development, experimentation and transfer to manufacturing.

• Develop and qualify solder ball attach, die/DRAM attach, component attach and deflux processes for NPI and test vehicles.
• Plan and execute experiments (DOE), analyze data (SPC) and document process specifications and improvements.
• Pathfind and qualify materials and processes for transfer to high-volume manufacturing.
• Perform fundamental studies to characterize materials and processes, identify failure modes, and recommend technology options.
• Optimize manufacturing processes to improve yield, quality, reliability, productivity and cost.
• Collaborate with cross-functional teams to integrate and assess material/process performance on products.

Requirements

Must-have skills and attributes for performing the role.

• Fundamental understanding of semiconductor assembly equipment and processes.
• Experience or knowledge in process development methods: design of experiments (DOE), statistical process control (SPC), and failure modes/effects analysis (FMEA).
• Technical familiarity with quality, yield improvement, process optimization and manufacturability considerations.
• Strong data analysis and problem-solving skills.
• Excellent written and verbal communication and influencing skills.
• Proactive attitude, ability to work under tight timelines and perform under pressure.

Nice-to-have:

• Research and development experience from graduate-level work (MSc/PhD) or equivalent R&D experience.

Education Requirements

BEng, MEng, MSc or PhD in Mechanical, Materials, Chemical, Electrical, Physics, Mechatronics or other relevant engineering disciplines. College graduate preferred; candidates with less than one year of experience are acceptable. Research and development background from MSc/PhD is preferred.

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.