Packaging Module Development Engineer
Intel CorporationJob Title
Packaging Module Development Engineer
Role Summary
Lead the design and optimization of advanced semiconductor packaging processes and equipment to improve reliability, yield, manufacturability, and cost in high-volume production. Work within Advanced Packaging Technology Manufacturing to develop assembly processes, materials, and qualification methods for mobile, edge, and high-performance computing products.
Collaborate with engineering, manufacturing, and suppliers to scale packaging solutions and drive process standardization.
Experience Level
Entry-level / College graduate role. Minimum 6+ months of relevant hands-on experience in process development or statistical methods is required.
Responsibilities
Primary responsibilities include process development, qualification, and cross-functional collaboration.
- Develop, optimize, and qualify packaging assembly processes and equipment to meet quality, reliability, yield, and cost targets.
- Apply design of experiments (DOE) and statistical process control (SPC) to improve process efficiency and manufacturability.
- Lead experimental design and prototype development to evaluate packaging technologies under simulated field-use conditions.
- Collaborate with cross-functional teams to address technical risks and provide consultation on packaging challenges.
- Establish specifications for materials and equipment and interface with suppliers to ensure performance and quality.
- Develop techniques, tools, and quality screens to identify issues early and address packaging reliability concerns.
- Document technical findings, process improvements, and qualification results in reports and technical summaries.
- Drive standardization across qualification procedures, manufacturing systems, and packaging methods.
Requirements
Must-have technical skills and preferred qualifications.
- Must-have: At least 6 months of experience in one or more of the following: proficiency with statistical methods (SPC, DOE); hands-on process development and characterization in packaging or manufacturing environments.
- Preferred: Familiarity with semiconductor fabrication processes, packaging flows, and assembly methodologies.
- Preferred: Knowledge of quality systems and documentation standards for manufacturing and packaging processes.
Education Requirements
PhD in Engineering, Physics, Chemistry, or a related STEM field is required.
About the Company
Company: Intel Corporation
Headquarters: Santa Clara, California, USA
Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.
