Job Title
Packaging Lab Engineer
Role Summary
Lead and execute mechanical and materials laboratory activities for advanced IC packaging technologies. The role focuses on test sample and fixture preparation, mechanical and thermal testing, data analysis, reporting, and technical follow-up to support product development and reliability investigations.
Works within a cross-functional engineering team and supports validation of materials, processes, and package designs in a lab environment.
Experience Level
Mid-level — typically requires at least 3 years of hands-on mechanical or materials testing experience in laboratory or engineering settings.
Responsibilities
Primary responsibilities include leading lab characterization work and providing technical analysis to inform design and reliability decisions.
- Lead day-to-day mechanical and thermal materials characterization for advanced IC packages.
- Execute tests, perform data reduction, and conduct engineering analysis of package-level mechanical and materials behavior.
- Apply and refine test methodologies, fixtures, and tooling to support materials and package validation.
- Prepare test samples and fixtures, including tooling and machining support for reliable, repeatable testing.
- Generate engineering reports and technical summaries documenting results, observations, and conclusions.
- Support failure analysis through mechanical and materials testing and data interpretation.
- Collaborate with engineers, technicians, and cross-functional teams to support development, NPI, and lab operations; may require flexible hours or alternate shifts.
Requirements
Must-have technical skills and preferred qualifications below.
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Must-have: 3+ years hands-on experience in mechanical or materials testing in laboratory or engineering environments (experience in quality, reliability, or failure analysis labs preferred).
- Experience with thermal-mechanical test equipment (thermal analyzers, universal testing machines, shear testers, tool microscopes).
- Experience with tooling, measurements, and technical drawings for test specimen or fixture fabrication; basic machining/tooling skills.
- Ability to perform data reduction, engineering analysis, and produce technical reports.
- Familiarity with quality-system laboratory environments (e.g., ISO 17025, IATF 16949) and failure analysis workflows.
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Nice-to-have: Experience developing test methodologies or materials characterization for semiconductor or electronics packages; knowledge of ASTM, JEDEC, IPC standards; experience with statistical analysis tools (JMP, Minitab) or scripting/data processing (Python, R); technical documentation and communication skills; Mandarin fluency and basic English proficiency.
Education Requirements
Bachelor’s degree in Materials Science, Mechanical Engineering, Chemical Engineering, Electrical Engineering, or related field; OR an Associate’s degree with significant relevant laboratory or industry experience; OR 3+ years of relevant industry experience may be accepted as equivalent to degree requirements.
About the Company
Company: Qualcomm
Headquarters: San Diego, California, United States
Qualcomm is a global leader in semiconductor and telecommunications equipment, specializing in mobile technologies and innovations. Known for its Adreno GPUs, the company provides solutions enabling advancements in mobile gaming, AI, VR/AR, and autonomous driving. Qualcomm's cutting-edge technology and commitment to high-performance, power-efficient designs drive the evolution of mobile graphics and connectivity worldwide.

Date Posted: 2026-05-07