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Packaging Intern

Qorvo
August 31, 2026
Internship
On-site
Greensboro, North Carolina, United States
$31 - $42 USD hourly
Other Semiconductor Jobs, Level - Entry or Early Career

Job Title

Packaging Intern

Role Summary

Internship within Qorvo's Global Operations Packaging Engineering group supporting semiconductor packaging projects. Work includes hands-on exposure to assembly processes, material and BOM reviews, and support for project deployment and process improvement.

Experience Level

Entry-level / Internship β€” intended for current college students enrolled in an accredited Bachelor's, Master's, or PhD program.

Responsibilities

Typical responsibilities during the internship include:

  • Learn and assist with technology development project methodologies and design rules.
  • Support review of assembly and marking diagrams to identify improvements.
  • Material and BOM review and support for project deployment activities.
  • Onsite hands-on learning in semiconductor assembly processes (e.g., wire bond, die attach, flip chip).
  • Support documentation and continuous improvement tasks (for example, A3 documentation as part of Lean).
  • Present findings and progress to mentors and business leaders.

Requirements

Must-have technical skills and attributes:

  • Mechanical/material engineering fundamentals and practical skills.
  • Familiarity with packaging materials (solder, epoxy, flux, mold compound) and assembly processes.
  • Experience or coursework using simulation software (ANSYS, COMSOL, SolidWorks Simulation) is preferred.
  • Ability to automate simulation tasks with scripting or macros is a plus.
  • Strong communication, presentation, analytical and problem-resolution skills.
  • Ability to work onsite in Greensboro, NC and participate in hands-on lab/assembly activities.
  • This position is not eligible for visa sponsorship by the company.

Education Requirements

Candidates must be currently enrolled in an accredited Bachelor's, Master's, or PhD program. A BS in Materials Science or Mechanical Engineering is listed as the baseline qualification; related technical majors are appropriate. Minimum 3.0 GPA preferred.


About the Company

Company: Qorvo

Headquarters: Greensboro, NC, US

Qorvo supplies innovative semiconductor solutions that enhance connectivity and power for a variety of applications, including consumer electronics, automotive, and healthcare. With a focus on RF and power solutions, Qorvo combines technology leadership and global manufacturing to address complex challenges in fast-growing industries. Their commitment to excellence and innovation drives them to shape the future of wireless communications.

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Date Posted: 2026-08-31