Packaging Integration Engineer (2027 New College Graduate)
GlobalFoundriesJob Title
Packaging Integration Engineer (2027 New College Graduate)
Role Summary
Support development of electro‑optical transceivers on GF's Photonix platform and advanced 2.5D/3D co‑packaged optics. This hands‑on role focuses on chip‑package co‑design for thermal, mechanical, electrical and optical performance, reliability, and manufacturability.
Work cross‑functionally with internal engineering teams and OSAT partners to translate product requirements into packaging design rules and production‑ready modules.
Experience Level
Entry-level — New college graduate (2027). Intended for recent graduates or graduating students; approximately 0–1 years of professional experience.
Responsibilities
Key responsibilities include design enablement, analysis, and support for product qualification and production readiness:
- Contribute to packaging design rules, product requirements, and manufacturing process development for silicon photonics packaging.
- Participate in cross‑functional design reviews and resolve technical, manufacturability, reliability, and yield concerns.
- Develop and apply simulation and analysis models to evaluate package performance, manufacturability, cost, and quality.
- Document engineering findings and recommendations for stakeholders.
- Support qualification robustness and continuous improvement from concept through production readiness.
- Perform work in compliance with Environmental, Health, Safety & Security requirements.
Requirements
Summary of must-have and preferred qualifications. Degree and field requirements are listed under Education Requirements below.
Must-have:
- Eligibility as a 2027 new college graduate for a full‑time role.
- English fluency — strong written and verbal communication.
- Willingness to travel up to 10%.
Nice-to-have:
- Prior related internship or co‑op experience.
- Leadership experience in projects, competitions, or work settings.
- Interest in leveraging AI tools and emerging technologies to improve productivity and decision‑making.
- Project management, planning, and organizational skills.
- Coursework, research, or project experience in advanced packaging, chip‑package co‑design, photonics, thermal/mechanical analysis, materials, reliability, or packaging process integration.
Education Requirements
Graduating with a Bachelor's or Master's degree in Electrical Engineering, Mechanical Engineering, Materials Science, Photonics, Optical Engineering, Packaging Engineering, or a related technical field from an accredited program. Minimum overall GPA: 3.0. Targeted to 2027 new college graduates.
About the Company
Company: GlobalFoundries
Headquarters: Saratoga Springs, New York, USA
GlobalFoundries is a leading contract manufacturer for the global semiconductor industry, with facilities in multiple countries, including the USA. The company develops a broad portfolio of semiconductor technologies and employs around 13,000 people worldwide. GlobalFoundries focuses on enhancing competitiveness in specialized application solutions and fostering innovation in mobile communications, consumer electronics, and automotive applications.
