Packaging Integration Engineer (2026 New College Graduate)

Job Title

Packaging Integration Engineer (2026 New College Graduate)

Role Summary

Join the Advanced Packaging and Silicon Photonics team to support development and manufacturing of electro-optical transceivers using GF’s Photonix platform and advanced 2.5D/3D packaging technologies. Work cross-functionally to integrate assembly processes, execute process development and reliability characterization, and analyze data to improve manufacturability and product performance.

Experience Level

Entry-level. Targeted to new college graduates (Bachelors, Masters, or PhD) with academic, internship, co-op, or research experience relevant to semiconductor packaging or related STEM areas.

Responsibilities

Primary responsibilities include hands-on support for package integration, process development, and reliability characterization.

• Support assembly process integration activities for silicon photonics and advanced packaging products.
• Assist with process development, characterization, and qualification of new package technologies.
• Analyze engineering and manufacturing data to identify process improvement opportunities.
• Participate in failure analysis and root-cause investigations for packaging and assembly issues.
• Support package reliability testing and characterization efforts.
• Collaborate with design, product, manufacturing, quality, and supplier teams to resolve technical challenges.
• Contribute to design rule development and manufacturability assessments for new products.
• Document experimental results and communicate findings via reports and presentations.
• Participate in continuous improvement initiatives focused on yield, quality, cost, and reliability.
• Perform work in compliance with Environmental, Health, Safety & Security requirements; travel up to 10% as needed.

Requirements

Must-have technical skills and capabilities for an entry-level packaging integration engineer.

• Basic understanding of semiconductor packaging, silicon photonics, materials science, reliability, or manufacturing processes gained via coursework, research, internships, or projects.
• Demonstrated analytical and problem-solving skills; experience analyzing experimental or engineering data.
• Experience with data-driven analysis and reporting of experimental results.
• Ability to work effectively within cross-functional teams and communicate technical information clearly in English (written and verbal).
• Willingness to participate in failure analysis, reliability testing, and process qualification activities.
• Willingness to travel up to 10%.

Nice-to-have:

• Prior internship, co-op, research, or project experience in semiconductor packaging, silicon photonics, reliability engineering, failure analysis, or materials characterization.
• Familiarity with Design of Experiments (DOE) and statistical data analysis tools.
• Knowledge of advanced packaging technologies (flip-chip, chiplets, 2.5D, 3D integration).
• Leadership, project management, planning, and organizational skills.

Education Requirements

Graduating with a Bachelor's, Master's, or PhD in Materials Science Engineering, Mechanical Engineering, Electrical Engineering, Chemical Engineering, Physics, or a related STEM discipline from an accredited degree program. Minimum overall GPA of 3.0 required.

About the Company

Company: GlobalFoundries

Headquarters: Saratoga Springs, New York, USA

GlobalFoundries is a leading contract manufacturer for the global semiconductor industry, with facilities in multiple countries, including the USA. The company develops a broad portfolio of semiconductor technologies and employs around 13,000 people worldwide. GlobalFoundries focuses on enhancing competitiveness in specialized application solutions and fostering innovation in mobile communications, consumer electronics, and automotive applications.