CUF TD Module Engineer

Job Title

CUF TD Module Engineer

Role Summary

This role develops and improves capillary underfill (CUF) module assembly processes, equipment, and reliability evaluation methods to support package manufacturability and Intel's packaging roadmap. The position is based onsite in Kulim and requires regular onsite presence to perform core responsibilities.

Experience Level

Mid-level — guidance: at least 3 years of relevant industry experience in semiconductor assembly, packaging, or related process engineering.

Responsibilities

Key responsibilities include developing, qualifying, and improving CUF module assembly processes and associated equipment to meet quality, reliability, cost, yield and manufacturability targets.

• Develop assembly processes and equipment for CUF modules and apply novel concepts to enable future packaging platforms.
• Optimize manufacturing flows to improve yield, productivity, cost, and reliability.
• Create process and equipment specifications; apply design of experiments (DOE) and data analysis; document results.
• Design and maintain test equipment to evaluate silicon and package technologies under thermal, humidity, cycling and mechanical stresses.
• Ensure manufacturability of package layouts and oversee manufacturing process flows and procedures.
• Define material specifications for contract assemblers and raw material vendors; interface with supplier quality and procurement.
• Develop screening methods, acceleration techniques and tools for early detection of packaging quality and reliability issues.
• Define reliability requirements and influence design, material selection and process development based on failure-mechanism understanding.
• Lead problem-solving and continuous improvement initiatives using experimental design and statistical methods; provide technical consultation to stakeholders.
• Standardize product qualification and manufacturing quality methods and coordinate with packaging technology and partner engineering teams on process maturity and risk mitigation.

Requirements

Essential skills and experience for the role.

• Minimum ~3+ years experience in semiconductor packaging, assembly process engineering, or related manufacturing environment.
• Fundamental understanding of semiconductor assembly equipment and processes.
• Experience applying DOE, statistical analysis and data-driven process improvement.
• Experience with environmental and mechanical reliability testing (temperature, humidity, thermal cycling, mechanical stress) and qualification methods.
• Ability to develop process specifications and interface effectively with suppliers and manufacturing teams.
• Strong problem-solving skills and experience leading process development or continuous improvement projects.
• Must be able to work onsite in Kulim, Malaysia.
• Nice-to-have: experience developing hardware/toolsets for new assembly processes; hands-on equipment development; prior CUF or packaging-specific experience.

Education Requirements

Prefer MSc or PhD in Mechanical, Materials, Electrical, Chemical Engineering, Physics, or related field with focus on thermal/fluid/packaging assembly process engineering. A Bachelor's degree with strong relevant experience is acceptable.

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.