Packaging Engineering Manager

Job Title

Packaging Engineering Manager

Role Summary

Lead a team in Emerging Packaging and Test to define, design, develop and scale high-voltage (200–3300V) packages and high-power modules for Industrial, Automotive, Renewable and Telecom markets. Drive package and module roadmaps, supplier selection, and scale-up to high-volume manufacturing.

Work includes technical direction across HV technologies (GaN, SiC, IGBT, isolation), validation using CFD/thermomechanical/electrical-parasitic tools, and defining reliability and qualification strategies.

Experience Level

Senior — requires 10+ years of relevant experience in high-voltage (200–3300V) and high-power (5 kW–300 kW) semiconductor packaging.

Responsibilities

Key responsibilities include technical leadership, roadmap definition, design validation, supplier and manufacturing engagement, and ensuring rapid time-to-market.

• Lead and manage a team of packaging technologists; set technical priorities and deliverables.
• Define package and module roadmaps based on market trends and system requirements.
• Architect and validate solutions across HV technologies (GaN, SiC, IGBT, isolation) using CFD, thermomechanical and electrical parasitic extraction tools.
• Identify and qualify prototype/subcontract partners; assess manufacturing capabilities and drive first-article builds.
• Develop process flows and technologies required to scale concepts to high-volume manufacturing.
• Define reliability and qualification plans, run testing, analyze failure modes, and implement corrective actions.
• Manage materials and supplier selection for mold compounds, die attach, substrates and related BOM items.
• Collaborate with worldwide cross-functional teams to accelerate development cycles and ensure on-time product launches.

Requirements

Must-have skills and experience; concise and focused on technical and leadership qualifications.

• 10+ years of experience with high-voltage (200–3300V) and high-power (5 kW–300 kW) semiconductor packaging and power modules.
• Proven experience across GaN, SiC, IGBT and Super Junction MOSFET packaging technologies.
• Hands-on experience with high-voltage package and power module design, materials, equipment, and assembly flows (examples: TOLT, TOLG, Q-DPAK, DIP, SIP, case modules).
• Prior experience scaling HV packages and modules from concept to high-volume manufacturing.
• Familiarity with clip attach, flip-chip packaging and wafer bumping processes.
• Strong knowledge of HV bill of materials (mold compounds, die attach, DBC substrates).
• Hands-on experience with stress, thermal and electrical modeling and analysis tools.
• Experience defining and driving reliability and qualification strategies and standards.
• Proven leadership and people-management skills; ability to work across global cross-functional teams.
• Track record of presenting at international conferences or symposiums related to power electronics, semiconductor packaging, or high-voltage technologies.
• Proficiency in English and Japanese.

Nice-to-have:

• Experience specifically with CFD and electrical-parasitic extraction tools in package validation workflows.

Education Requirements

Bachelor's (BS) degree in Mechanical Engineering, Materials Science, Electrical Engineering or a related engineering discipline is specified.

About the Company

Company: Texas Instruments

Headquarters: Dallas, Texas, USA

Texas Instruments is a global semiconductor company that designs, manufactures, and sells analog and embedded processing chips for various markets including industrial, automotive, and personal electronics. The company's innovations aim to make electronics more affordable and reliable, fostering advancements in technology through each generation of semiconductors.