Packaging Engineering Intern
QorvoJob Title
Packaging Engineering Intern
Role Summary
Work within Qorvo's Global Operations packaging engineering team to support advanced packaging and substrate technology projects. The role provides hands-on semiconductor assembly experience, support for design-of-experiments, diagram review, documentation, and continuous improvement activities.
Experience Level
Entry-level / Internship — current college student enrolled in an accredited Bachelor's, Master's, or PhD program; no specific prior professional experience required.
Responsibilities
Typical responsibilities include:
- Assist on advanced packaging and substrate technology development and process improvement.
- Learn substrate design rules and manufacturing processes and support process documentation.
- Review assembly and marking diagrams and recommend improvements.
- Plan and execute design of experiments (DOE) to support project deployment.
- Perform supervised onsite hands-on semiconductor assembly processes (e.g., wire bond, die attach, flip chip).
- Support materials testing and evaluation for solder, epoxy, flux, and mold compounds.
- Contribute to documentation and continuous improvement activities (A3s, Lean) and present results to stakeholders.
Requirements
Must-have skills and conditions:
- Knowledge or coursework in packaging materials and assembly processes; practical or theoretical experience preferred.
- Fundamental engineering skills in mechanical/materials/chemical/electrical domains and basic lab proficiency.
- Strong analytical thinking, problem-solving, and the ability to manage and drive resolution of assigned tasks.
- Good communication and presentation skills.
- Ability to work onsite in a manufacturing or lab environment and perform hands-on activities.
- Experience with PCB/PCG design software (Altium, KiCAD) is preferred but not required.
- This position is not eligible for visa sponsorship.
Education Requirements
Enrollment in an accredited Bachelor's, Master's, or PhD program. Preferred fields: Materials Science, Chemical Engineering, Mechanical Engineering, Electrical Engineering, or related technical fields. Minimum 3.0 GPA stated.
About the Company
Company: Qorvo
Headquarters: Greensboro, NC, US
Qorvo supplies innovative semiconductor solutions that enhance connectivity and power for a variety of applications, including consumer electronics, automotive, and healthcare. With a focus on RF and power solutions, Qorvo combines technology leadership and global manufacturing to address complex challenges in fast-growing industries. Their commitment to excellence and innovation drives them to shape the future of wireless communications.
