Packaging Engineer

Job Title

Packaging Engineer

Role Summary

Experienced package design engineer responsible for end-to-end execution of advanced package designs (substrates, interposers, bump maps) to meet performance, cost, quality, and schedule targets. Works on heterogeneous integration and chiplet-based architectures and drives design methodology, automation, and cross-functional alignment.

Experience Level

Mid-level (individual contributor with significant hands-on packaging experience). No explicit years-of-experience specified.

Responsibilities

Primary responsibilities focus on technical delivery, cross-functional coordination, and process improvement.

• Lead end-to-end package design execution for complex products, ensuring performance, cost, quality, and schedule targets are met.
• Develop substrate layouts, bump maps, and interposer designs for advanced packaging (2.5D/3D, chiplet-based architectures).
• Manage multiple concurrent design programs in fast-paced, high-pressure environments.
• Collaborate with SI/PI, mechanical, SoC, OSATs, foundries, and substrate suppliers to drive design decisions and delivery.
• Participate in design reviews, signoff readiness, and tapeout processes; communicate risks and mitigation strategies to stakeholders.
• Define and enhance package design methodologies, flows, reuse, and standardization; promote automation and AI/ML to improve productivity.
• Mentor junior engineers and promote engineering excellence across the team.

Requirements

Must-have technical skills and attributes; preferred items are noted when applicable.

• Proven track record executing complex package designs and meeting schedule and quality targets.
• Hands-on experience creating substrate layouts, bump maps, and interposer designs for advanced packaging.
• Solid understanding of signal integrity (SI) and power integrity (PI) fundamentals.
• Experience working directly with OSATs, foundries, and substrate vendors.
• Familiarity with EDA/packaging tools and automation workflows; ability to apply AI/ML to improve design productivity and quality.
• Ability to operate with minimal supervision, take ownership of programs, and influence cross-functional teams.
• Strong communication skills and experience mentoring junior engineers.
• Preferred: experience with complex substrate design, silicon bridge, or interposers.

Education Requirements

Bachelor's degree or higher in Electrical Engineering, Computer Engineering, or a related technical field (the posting also allows equivalent qualifications).

About the Company

Company: Advanced Micro Devices

Headquarters: Sunnyvale, California, USA

Advanced Micro Devices, or AMD, is a global semiconductor company that designs and manufactures microprocessors, graphics processors, and related technologies for a variety of computing devices. Known for pushing the boundaries of innovation, AMD's mission is to deliver high-performance computing solutions for AI, data centers, gaming, and embedded applications. They foster a collaborative, inclusive culture focused on creativity and problem-solving, aiming to drive progress and excellence in technology.