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Packaging Engineer (2027 New Graduate, Chengdu)

Texas Instruments
July 31, 2026
Full-time
On-site
Chengdu, Sichuan, China
Process Engineering Jobs, Level - Entry or Early Career

Job Title

Packaging Engineer (2027 New Graduate, Chengdu)

Role Summary

Entry-level packaging engineer participating in TI's TMG Development 12-month program and Career Accelerator Program. The role supports design, development and analysis of semiconductor packaging technologies to meet reliability, performance, and miniaturization goals.

Experience Level

Entry-level / New graduate. Role targets recent college graduates; no specific years of prior professional experience required.

Responsibilities

Typical responsibilities include:

  • Collaborate with product teams to design and develop internal and external semiconductor package solutions (wirebond, flip chip, modules, SiPs, advanced packages).
  • Participate in cross-functional teams to support product qualification and transition to production, ensuring reliability, yield, and testability targets.
  • Plan and execute design-of-experiments and work with material suppliers to evaluate packaging materials and processes.
  • Perform electrical, mechanical and thermal modeling to understand silicon-to-package interactions and establish design guidelines.
  • Support failure analysis, characterization, and materials evaluation to improve package performance and reliability.
  • Communicate technical results and coordinate with manufacturing, reliability, and test organizations.

Requirements

Core requirements and preferred skills.

  • Must-have: strong analytical and problem-solving skills; effective written and verbal communication; ability to work in teams and manage time to deliver projects on schedule.
  • Authorization to work in China (Texas Instruments will not sponsor visas for this position).
  • Nice-to-have: basic understanding of statistical process control (SPC); familiarity with semiconductor packaging manufacturing, assembly, reliability, materials, characterization, or failure analysis; experience with modeling or test structures is a plus.
  • Ability to adapt in a fast-paced, changing environment and take initiative to drive results.

Education Requirements

Bachelor's degree is specified (role targeted to new college graduates via a 12-month development program). No specific field of study or certifications were listed.


About the Company

Company: Texas Instruments

Headquarters: Dallas, Texas, USA

Texas Instruments is a global semiconductor company that designs, manufactures, and sells analog and embedded processing chips for various markets including industrial, automotive, and personal electronics. The company's innovations aim to make electronics more affordable and reliable, fostering advancements in technology through each generation of semiconductors.

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Date Posted: 2026-07-31