Packaging Engineer

Job Title

Packaging Engineer

Role Summary

Join the package design organization to develop and deploy AI-driven automation workflows that improve efficiency, quality, and scalability of advanced package, bridge, and interposer design. Work spans substrates, silicon interposers and bridge-based heterogeneous integration to accelerate design and tape-out readiness.

Experience Level

Mid-level (Member of Technical Staff). Preferred: 5+ years' experience in semiconductor packaging or SoC physical design automation.

Responsibilities

Deliver automation and AI-enabled tooling to reduce manual effort, improve design robustness, and support tape-outs.

• Develop, deploy, and maintain automation frameworks and AI-assisted workflows for package substrates, silicon interposers and bridge-based designs.
• Apply AI/ML techniques to placement optimization, auto-routing, signal integrity and power delivery improvements, and design-rule compliance.
• Collaborate with package designers to identify high-impact automation opportunities and reduce cycle time.
• Partner with EDA teams and vendors to integrate automation features and enhance tool capabilities.
• Implement data extraction, flow integration, and closed-loop optimization with simulation teams.
• Support execution of design milestones and tape-outs, ensuring automation readiness and quality.
• Document best practices and create reusable workflows for team adoption.

Requirements

Core technical skills and experience required for successful performance in this role.

• Must-have: Several years of hands-on experience in semiconductor packaging design and automation or SoC physical design automation.
• Must-have: Proficiency in scripting and automation (Python preferred; Tcl, SKILL or C++ acceptable).
• Must-have: Practical knowledge of EDA packaging tools (examples: Cadence APD/SiP, Siemens Xpedition, Synopsys 3DICC) or equivalent.
• Must-have: Understanding of design verification flows (DRC/LVS), parasitic extraction, and SI/PI fundamentals.
• Must-have: Experience working with cross-functional teams (Design, SI/PI, Mechanical, EDA) and delivering production-ready automation for tape-outs.
• Nice-to-have: Experience applying AI/ML to engineering workflows and familiarity with frameworks such as PyTorch or TensorFlow.
• Nice-to-have: Deep familiarity with advanced packaging technologies (2.5D/3D IC, chiplets, interposers, bridge architectures).

Education Requirements

Bachelor's or higher degree in Electrical Engineering, Computer Engineering, Computer Science or a related technical field.

About the Company

Company: Advanced Micro Devices

Headquarters: Sunnyvale, California, USA

Advanced Micro Devices, or AMD, is a global semiconductor company that designs and manufactures microprocessors, graphics processors, and related technologies for a variety of computing devices. Known for pushing the boundaries of innovation, AMD's mission is to deliver high-performance computing solutions for AI, data centers, gaming, and embedded applications. They foster a collaborative, inclusive culture focused on creativity and problem-solving, aiming to drive progress and excellence in technology.