Packaging development engineer

Job Title

Packaging development engineer

Role Summary

Lead development, optimization, and integration of flip-chip front-end (FC-FE) die attach and underfill processes for semiconductor packages. Ensure manufacturability, reliability, and yield from NPI through production by working with operations, quality, product engineering, suppliers, and subcontractors.

Experience Level

Senior - minimum of 5 years of experience in semiconductor packaging with strong exposure to FC-FE die attach and underfill dispensing processes.

Responsibilities

Primary responsibilities include process ownership, troubleshooting, NPI leadership, and cross-functional coordination.

• Own FC-FE die attach and underfill processes across package platforms; define and maintain critical process parameters for die placement, bonding, reflow, underfill dispensing, cure, and CSAM inspection.
• Design and execute DOE to improve yield, void control, fillet quality, underfill flow, cure profiles, and CSAM performance.
• Perform root cause analysis for yield excursions using structured methods (8D, Fishbone, 5-Why, FTA) and implement corrective/preventive actions.
• Drive continuous improvement projects and monitor yield and process capability metrics.
• Lead tooling, fixture, and dispense process improvements and work with vendors to support NPI requirements.
• Qualify, calibrate, and prepare die attach, underfill, and CSAM equipment for production deployment.
• Lead process development for new packages from concept to production release; develop process windows and DFM validation.
• Prepare and maintain process documentation: specifications, work instructions, and control plans.
• Mentor junior engineers and provide technical support for failure analysis and risk assessments.

Requirements

Must-have technical skills and experience; nice-to-have items listed separately.

• Minimum 5 years' experience in semiconductor packaging with hands-on exposure to FC-FE die attach and underfill processes.
• Experience in high-volume manufacturing and fast-paced development environments.
• Strong skills in process characterization, DOE, data analysis, and statistical process control.
• Proven root-cause problem-solving using structured methodologies (8D, 5-Why, FTA).
• Hands-on experience with die placement/bonding, reflow, underfill dispensing/cure, and CSAM inspection/analysis.
• Experience with equipment qualification, calibration, upgrades, and production readiness.
• Experience qualifying materials (die attach, flux, underfill) and working with suppliers on material issues.
• Ability to lead cross-functional teams, document processes, and collaborate on DFM requirements.
• Nice-to-have: familiarity with AI-based simulation tools for process or material analysis.

Education Requirements

Bachelor's degree in Mechanical Engineering, Materials Science, Chemical Engineering, or a related discipline.

About the Company

Company: NXP Semiconductors

Headquarters: Nijmegen, Netherlands

NXP Semiconductors N.V. is a global semiconductor company that provides High Performance Mixed Signal and Standard Product solutions. With over 45,000 employees and operations in more than 35 countries, NXP is a leader in secure connectivity solutions for embedded applications, catering to automotive, industrial IoT, mobile, and communication infrastructure markets. The company is committed to innovation and sustainability, advancing a smarter, safer, and more sustainable world through technology.