Packaging Design Integration Engineer (New College Graduate, 2026)

Job Title

Packaging Design Integration Engineer (New College Graduate, 2026)

Role Summary

Entry-level engineering role on the Advanced Packaging and Silicon Photonics team supporting chip-package co-design for electro-optical transceivers using GF's Photonix platform and advanced 2.5D/3D packaging technologies. Work with experienced engineers and cross-functional teams to support thermal, mechanical, electrical, and optical integration, manufacturability, and reliability assessments.

Experience Level

Entry-level (New college graduate). Intended for recent graduates with limited professional experience; typically 0–2 years of relevant coursework, internships, or research.

Responsibilities

Key day-to-day responsibilities include:

• Support packaging design integration activities for silicon photonics and advanced packaging products.
• Assist with thermal, mechanical, electrical, and optical chip-package co-design analysis under guidance.
• Contribute to design rule development, manufacturability assessments, and design review preparation.
• Use engineering data, simulations, and characterization results to evaluate design options and recommend improvements.
• Participate in cross-functional problem solving for technical, yield, quality, and reliability issues.
• Support development and documentation of design guidelines, technical reports, and presentation materials.
• Collaborate with design, product, process integration, manufacturing, quality, and supplier teams on new customer products.
• Participate in continuous improvement efforts focused on design quality, manufacturability, cost, and reliability.
• Perform work in compliance with Environmental, Health, Safety & Security requirements; travel up to 10% as needed.

Requirements

Applicants should meet the following must-have and preferred qualifications.

Must-have:

• Basic understanding of semiconductor packaging, silicon photonics, chip-package co-design, modeling/simulation, materials science, reliability, or manufacturing processes (gained via coursework, research, internships, or projects).
• Demonstrated analytical and problem-solving skills; experience analyzing experimental, simulation, or engineering data.
• Ability to work effectively in cross-functional teams and communicate technical information clearly.
• English proficiency (written and verbal).
• Willingness to travel up to 10% and follow EHS/safety procedures.

Nice-to-have:

• Prior internship, co-op, research, or project experience in advanced packaging, silicon photonics, chip-package interaction, thermal/mechanical/electrical/optical design, reliability, or process integration.
• Familiarity with design or modeling tools such as HFSS, Zemax/Zmax, FloTHERM, finite element analysis, electrical or optical simulation tools.
• Knowledge of advanced packaging technologies (flip-chip, chiplets, 2.5D, 3D integration).
• Familiarity with Design of Experiments (DOE), engineering statistics, or data analysis methods.
• Demonstrated leadership, project management, planning, and organizational skills.

Education Requirements

Graduating with a Bachelor's, Master's, or PhD in Mechanical Engineering, Electrical Engineering, Materials Science Engineering, Chemical Engineering, Physics, Optical Engineering, or a related STEM discipline from an accredited program. Minimum overall GPA of 3.0 required.

About the Company

Company: GlobalFoundries

Headquarters: Saratoga Springs, New York, USA

GlobalFoundries is a leading contract manufacturer for the global semiconductor industry, with facilities in multiple countries, including the USA. The company develops a broad portfolio of semiconductor technologies and employs around 13,000 people worldwide. GlobalFoundries focuses on enhancing competitiveness in specialized application solutions and fostering innovation in mobile communications, consumer electronics, and automotive applications.