Packaging Architect

Job Title

Packaging Architect

Role Summary

Lead the definition of package architecture and drive scale-up from prototypes to high-volume production. Collaborate with foundry and OSAT partners and work across advanced packaging, memory design, test, and product engineering to ensure robust, manufacturable products with high yield.

Experience Level

Senior-level role. Prefer candidates with extensive industry experience delivering assembly and packaging from concept to volume; the posting cites 10+ years as preferred.

Responsibilities

Primary responsibilities include strategy, partner collaboration, and enabling production-ready assemblies.

• Define package architecture strategy with foundry and OSAT partners.
• Drive scale-up engagements with OSAT partners for product families.
• Specify and drive assembly vehicles and proof-of-concept demonstrations with foundry/OSAT partners.
• Collaborate with advanced packaging, memory design, test, and product engineering teams to enable product development and manufacturability.
• Work with Product Engineering to develop test strategies that incorporate necessary assembly and packaging inputs.

Requirements

Must-have skills and experience:

• Proven track record executing large form-factor assemblies/packages for high-volume products.
• Ability to define package assembly strategy, including necessary test vehicle development.
• Hands-on experience with assembly tools and a deep understanding of yield modes and failure mechanisms.
• Strong communication and collaboration skills; experience working across geographic boundaries and with vendors and customers.
• Ability to work cross-functionally with internal engineering teams to drive manufacturability and yield.

Nice-to-have:

• Deep expertise in assembly packaging flows (wafer singulation, micro-bumping, mold/oxide re-constitution, fan-out RDL, passive interposer, TSV, C4 bumping, final package assembly).
• Experience from concept/definition through volume production with strong understanding of product manufacturability, yield, and reliability.

Education Requirements

MS or PhD in a relevant technical field preferred; the posting specifically mentions a Master's or PhD with a minimum of 10 years' experience in assembly/packaging. No other degree fields or certifications were specified.

About the Company

Company: Keplercompute

Headquarters: San Jose, California, United States

Kepler is a semiconductor startup developing a new class of AI memory and logic using advanced materials and 3D architectures to build UHBM-based 3D-memory AI accelerator platforms. The team includes experienced semiconductor veterans and partners with foundries and customers to move lab technologies toward production.