Package Thermal & Mechanical Simulation Engineer
NXP SemiconductorsJob Title
Package Thermal & Mechanical Simulation Engineer
Role Summary
Develop thermal and mechanical simulation models for semiconductor packages to predict reliability, identify technology limits, and optimize packaging solutions for first-time-right product qualification. Work within the Package Innovation Mechanical & Thermal Modelling team to support product and technology development across global teams, internal factories, and suppliers.
Experience Level
Mid-level. No specific years-of-experience requirement stated.
Responsibilities
Key responsibilities include:
- Develop and validate finite element and finite volume simulation models of package components and assemblies.
- Predict mechanical reliability and analyze thermal performance of package concepts and products.
- Support product development teams and package project leads on risk mitigation and design optimization.
- Troubleshoot package-related issues discovered during lifetime testing and contribute to root-cause analysis.
- Collaborate with global teams, internal factories, subcontractors, and suppliers to deliver optimized designs.
Requirements
Must-have skills and workplace expectations; preferred items noted.
- Proven experience with finite element modelling; experience with Ansys or Marc/Mentat preferred.
- Fluent in English.
- Willingness to be on-site at least 3 days per week (hybrid work arrangement).
- Preferred: understanding of semiconductor packaging technologies.
- Strong communicator and team player; self-starter with initiative, flexibility, and leadership skills.
Education Requirements
Master's or Ph.D. in Mechanical Engineering (or equivalent practical experience) is required.
About the Company
Company: NXP Semiconductors
Headquarters: Nijmegen, Netherlands
NXP Semiconductors N.V. is a global semiconductor company that provides High Performance Mixed Signal and Standard Product solutions. With over 45,000 employees and operations in more than 35 countries, NXP is a leader in secure connectivity solutions for embedded applications, catering to automotive, industrial IoT, mobile, and communication infrastructure markets. The company is committed to innovation and sustainability, advancing a smarter, safer, and more sustainable world through technology.
