Package Thermal & Mechanical Simulation Engineer

Job Title

Package Thermal & Mechanical Simulation Engineer

Role Summary

Develop and execute thermal and mechanical simulation models for semiconductor packages to predict reliability, identify technology limits, and support first-time-right product qualification. Work within the Package Innovation Mechanical & Thermal Modelling team based in Austin, TX, collaborating with product teams, project leads, factories and suppliers.

Experience Level

Mid-level. Specific years of experience not specified.

Responsibilities

Provide simulation support across package development projects and failure investigations. Key responsibilities include:

• Develop and validate finite element and finite volume models of semiconductor components and assemblies.
• Predict mechanical reliability and identify technology limits for package concepts.
• Analyze thermal performance of package concepts in modeled and real applications.
• Support root-cause analysis and problem-solving for issues found during testing and lifetime qualification.
• Collaborate with product development teams and package project leads to mitigate risk and optimize designs.
• Contribute to shortening development cycles through virtual prototyping and model-driven design decisions.

Requirements

Must-have skills and attributes, plus preferred qualifications.

• Must-have: Hands-on experience with finite element modelling; preferably with Ansys or Marc Mentat.
• Must-have: Practical experience building and using simulation models to support design and reliability predictions.
• Must-have: Fluent English and effective communication skills for cross-functional collaboration.
• Must-have: Willingness to be present on-site at the Austin office at least 3 days per week.
• Nice-to-have: Understanding of semiconductor packaging technologies and assembly processes.
• Nice-to-have: Experience supporting failure analysis, lifetime testing, or package qualification activities.
• Personal attributes: Self-starter, team player, strong influencer and networker.

Education Requirements

Master's or Ph.D. in Mechanical Engineering (or equivalent). The posting states a Master or Ph.D. in Mechanical Engineering or equivalent is required.

About the Company

Company: NXP Semiconductors

Headquarters: Nijmegen, Netherlands

NXP Semiconductors N.V. is a global semiconductor company that provides High Performance Mixed Signal and Standard Product solutions. With over 45,000 employees and operations in more than 35 countries, NXP is a leader in secure connectivity solutions for embedded applications, catering to automotive, industrial IoT, mobile, and communication infrastructure markets. The company is committed to innovation and sustainability, advancing a smarter, safer, and more sustainable world through technology.