Package Thermal & Mechanical Simulation Engineer
Develop and validate mechanical and thermal simulation models for semiconductor packages as part of the Package Innovation Mechanical & Thermal Modelling team at NXP Austin. The role focuses on predicting mechanical reliability, analyzing thermal performance, supporting product qualification, and enabling design optimization.
Mid-level. No explicit years-of-experience stated in the posting.
Key responsibilities include virtual prototyping, simulation-driven problem solving, and cross-team support for package development and testing.
Must-have skills and expectations; nice-to-have items noted separately.
Master's or Ph.D. in Mechanical Engineering (or equivalent). The posting allows equivalent practical experience in lieu of the stated degree.
Company: NXP Semiconductors
Headquarters: Nijmegen, Netherlands
NXP Semiconductors N.V. is a global semiconductor company that provides High Performance Mixed Signal and Standard Product solutions. With over 45,000 employees and operations in more than 35 countries, NXP is a leader in secure connectivity solutions for embedded applications, catering to automotive, industrial IoT, mobile, and communication infrastructure markets. The company is committed to innovation and sustainability, advancing a smarter, safer, and more sustainable world through technology.
