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Package Thermal & Mechanical Simulation Engineer

NXP Semiconductors
August 22, 2026
Full-time
On-site
Austin, Texas, United States
Other Semiconductor Jobs, Level - Mid-Career

Job Title

Package Thermal & Mechanical Simulation Engineer

Role Summary

Develop and validate mechanical and thermal simulation models for semiconductor packages as part of the Package Innovation Mechanical & Thermal Modelling team at NXP Austin. The role focuses on predicting mechanical reliability, analyzing thermal performance, supporting product qualification, and enabling design optimization.

Experience Level

Mid-level. No explicit years-of-experience stated in the posting.

Responsibilities

Key responsibilities include virtual prototyping, simulation-driven problem solving, and cross-team support for package development and testing.

  • Develop and run finite element/finite volume simulations of semiconductor components and assemblies.
  • Predict mechanical reliability and identify technology limits for package designs.
  • Analyze thermal performance of package concepts in modeled and real applications.
  • Support root-cause analysis and solve package issues found during lifetime testing.
  • Collaborate with product development teams and package project leads to mitigate risks and optimize designs.
  • Contribute to on-site team activities and coordinate with global teams and suppliers as needed.

Requirements

Must-have skills and expectations; nice-to-have items noted separately.

  • Proven experience with Finite Element Modeling; experience with Ansys or Marc Mentat preferred.
  • Ability to develop efficient and accurate simulation models that capture multi-physics behavior and nonlinearities.
  • Experience analyzing thermal performance of electronic packages and systems.
  • Fluent English and strong written/verbal communication skills.
  • Ability to work on-site in Austin at least 3 days per week.
  • Strong collaboration, influence, and problem-solving skills; self-starter with initiative.
  • Nice-to-have: direct understanding or experience with semiconductor packaging technologies and processes.

Education Requirements

Master's or Ph.D. in Mechanical Engineering (or equivalent). The posting allows equivalent practical experience in lieu of the stated degree.


About the Company

Company: NXP Semiconductors

Headquarters: Nijmegen, Netherlands

NXP Semiconductors N.V. is a global semiconductor company that provides High Performance Mixed Signal and Standard Product solutions. With over 45,000 employees and operations in more than 35 countries, NXP is a leader in secure connectivity solutions for embedded applications, catering to automotive, industrial IoT, mobile, and communication infrastructure markets. The company is committed to innovation and sustainability, advancing a smarter, safer, and more sustainable world through technology.

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Date Posted: 2026-08-21