Package/System Design Solution Engineer, Senior

Job Title

Package/System Design Solution Engineer, Senior

Role Summary

The IC Package System Design team develops package selection, architecture, design methodology, implementation and verification for Qualcomm package products across digital, RF, analog and PMIC domains. The role focuses on package selection and electrical modeling, and on system co-design across die, package and PCB to meet footprint, thermal, SI, PDN and cost targets.

Experience Level

Senior level. The posting cites experience guidance of ~3+ years hardware engineering experience; alternative minimums in the source allow Bachelor's+2+ years or Master's+1+ year in system/package design roles.

Responsibilities

Work with cross-functional teams to define and deliver package solutions that meet electrical, mechanical and thermal requirements while optimizing cost and manufacturability.

• Perform package selection, package design and electrical/package modeling for IC-PKG-PCB systems.
• Drive IC top-level floorplanning: hard macro placement, padring, RDL and bump assignment.
• Develop and apply system-level co-design methodology across chip, package and PCB.
• Analyze concepts for new product packages considering mechanical, thermal and electrical trade-offs and system cost.
• Implement package design flows addressing high-speed SI constraints (impedance, IR drop, crosstalk) and PDN constraints for high-frequency processors.
• Collaborate with IC/product/marketing teams on competitive analysis and package technology roadmaps.

Requirements

Summary of key technical and experiential requirements. Education degree details are listed separately under Education Requirements.

• Must-have: Practical experience in IC package or PCB selection, design and layout; familiarity with chip-package-board co-design and top-level floorplanning/IO placement.
• Must-have: Experience with signal integrity and power distribution network topics for high-speed/high-frequency processors.
• Must-have: Demonstrated ability to develop package design flows and perform concept trade-offs for performance, power and cost.
• Nice-to-have: Experience with 2D/3D EM simulation tools and transmission-line/electromagnetic theory.
• Nice-to-have: Familiarity with assembly and substrate manufacturing processes, PCB stack-ups and breakout strategies.

Education Requirements

Source lists Bachelor's degree in Engineering, Information Systems, Computer Science or related fields; specific mentions include Electrical Engineering, Mechanical Engineering and Chemical Engineering. Preferred: Master's (Electrical Engineering). Alternate minimums in the source allow Bachelor's + 2+ years, Master's + 1+ year, or PhD in relevant engineering fields. The posting also permits related work experience in lieu of degrees.

About the Company

Company: Qualcomm

Headquarters: San Diego, California, United States

Qualcomm is a global leader in semiconductor and telecommunications equipment, specializing in mobile technologies and innovations. Known for its Adreno GPUs, the company provides solutions enabling advancements in mobile gaming, AI, VR/AR, and autonomous driving. Qualcomm's cutting-edge technology and commitment to high-performance, power-efficient designs drive the evolution of mobile graphics and connectivity worldwide.