Package/System Design Solution Engineer, Senior

Job Title

Package/System Design Solution Engineer, Senior

Role Summary

Join the IC Package System Design team responsible for package roadmapping, architecture, methodology, implementation and verification across Qualcomm package products (digital, RF, analog, PMIC). The role focuses on package selection, electrical modeling, and system co-design of IC–package–PCB to meet footprint, thermal, signal integrity and power distribution constraints.

Experience Level

Senior. Candidates typically have multiple years of hardware or package/system design experience (see Requirements and Education Requirements for specific experience pathways).

Responsibilities

Key responsibilities include system-level package engineering and collaboration with product teams.

• Select package options and define package architecture to meet mechanical, thermal and electrical requirements.
• Design package layouts, pinmaps, RDL and bump assignments; support IC top-level floorplanning and hard-macro placement.
• Develop package electrical models and perform signal-integrity (impedance, crosstalk) and PDN (IR drop) analyses.
• Optimize IC–package–PCB co-design for footprint/height, thermal performance, and system cost.
• Apply package design flows and constraints for high-speed interfaces and high-frequency processor cores.
• Collaborate with IC, PCB, product and marketing teams on technology roadmaps and competitive analysis.

Requirements

Must-have experience and core skills; preferred items listed separately.

• Minimum several years of hands-on hardware, system or package engineering experience (company lists multiple acceptable experience paths; see Education Requirements for degree/experience combinations).
• Experience with IC package and/or PCB selection, layout, and pinmap optimization.
• Practical knowledge of signal-integrity and power-distribution considerations in package and board design.
• Familiarity with die floorplanning, IO and bump placement, and Chip/Package/PCB co-design methodology.
• Ability to evaluate trade-offs among cost, technology, performance, power and thermal constraints.

Nice-to-have:

• Experience with 2D/3D electromagnetic simulation tools and transmission-line theory.
• Familiarity with assembly and substrate manufacturing processes and PCB stack-up/breakout strategies.

Education Requirements

Degrees and equivalent experience pathways stated in the source: Bachelor's degree in Engineering, Information Systems, Computer Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering or a related field is listed. Preferred: Master's in Electrical Engineering. Alternative experience paths explicit: Bachelor's + 2–3+ years relevant system/package/design experience; Master’s + 1+ year; or PhD in a related engineering field. The posting also accepts related work experience in lieu of formal degrees.

About the Company

Company: Qualcomm

Headquarters: San Diego, California, United States

Qualcomm is a global leader in semiconductor and telecommunications equipment, specializing in mobile technologies and innovations. Known for its Adreno GPUs, the company provides solutions enabling advancements in mobile gaming, AI, VR/AR, and autonomous driving. Qualcomm's cutting-edge technology and commitment to high-performance, power-efficient designs drive the evolution of mobile graphics and connectivity worldwide.