Package/System Design Engineer (PMIC SIP and Module)

Job Title

Package/System Design Engineer (PMIC SIP and Module)

Role Summary

The Package/System Design Engineer will design and verify IC package and system-level solutions for PMIC, SiP and module products. The role works within the IC Package System Design team responsible for package roadmapping, architecture, methodology, implementation and verification across digital, RF, analog and power products.

Primary objectives: optimize mechanical, thermal and electrical performance, enable high-speed signal and power integrity, and minimize system-level cost through IC/package/PCB co-design.

Experience Level

Entry-level — typically 2+ years hardware engineering experience or equivalent practical experience.

Responsibilities

Design and verification tasks across package and board system levels; collaborate with IC, product and marketing teams.

• Board-level system design: schematics, component selection, performance optimization and verification.
• IC top-level floorplanning: hard macro placement, pad ring, RDL and bump pattern/assignment.
• Co-design methodology for IC, package and PCB/board to meet electrical, thermal and mechanical requirements.
• Evaluate and select package solutions based on system-level trade-offs and cost targets.
• Define package design flows enforcing SI constraints (impedance, IR drop, cross-talk) and RF constraints (impedance matching, coupling, desense).
• Implement PDN constraints and optimization techniques for high-frequency processor cores across die/package/PCB.
• Work with marketing and product teams on competitive analysis and technology roadmaps.

Requirements

Must-have skills and experience followed by preferred qualifications.

• Must-have: 2+ years hardware engineering experience or equivalent practical experience.
• Must-have: Experience with board-level system design, schematic capture and component selection.
• Must-have: Experience or working knowledge of IC floorplanning, IO placement and bump placement.
• Must-have: Understanding of IC/package/PCB co-design methodologies and system-level trade-offs.
• Must-have: Knowledge of signal integrity (impedance, cross-talk) and power integrity (IR drop, PDN) constraints.
• Nice-to-have: Experience in IC package and PCB selection, layout, and pinmap optimization.
• Nice-to-have: Experience with 2D/3D EM simulation tools and electromagnetic/transmission line theory.
• Nice-to-have: Familiarity with assembly and substrate manufacturing processes, PCB stack-up and breakout strategy.

Education Requirements

Required: Bachelor's degree in Engineering (examples listed in the source include Electrical Engineering, Mechanical Engineering, Chemical Engineering, Information Systems, Computer Science) or a related field. Preferred: Master's degree in Electrical Engineering. The posting allows equivalent practical or related work experience in lieu of formal degree requirements.

About the Company

Company: Qualcomm

Headquarters: San Diego, California, United States

Qualcomm is a global leader in semiconductor and telecommunications equipment, specializing in mobile technologies and innovations. Known for its Adreno GPUs, the company provides solutions enabling advancements in mobile gaming, AI, VR/AR, and autonomous driving. Qualcomm's cutting-edge technology and commitment to high-performance, power-efficient designs drive the evolution of mobile graphics and connectivity worldwide.