Package Silicon Technology Node Development — Member of Technical Staff (MTS)

Job Title

Package Silicon Technology Node Development — Member of Technical Staff (MTS)

Role Summary

Lead chip-package interaction (CPI) technology strategy and roadmaps to enable advanced silicon node transitions for next-generation memory products. Operate at the intersection of silicon, package, and system-level integration to ensure technology readiness and mitigate risks across design and process domains.

Position sits in Package Development Engineering (PDE) and requires cross-functional collaboration with fab process integration, product development, package design, assembly technology development, and global quality teams.

Experience Level

Senior — senior technical leadership role (experience not explicitly stated in source).

Responsibilities

Primary responsibilities focus on defining strategy, driving execution, and ensuring robust CPI implementation for advanced nodes.

• Define and drive CPI technology strategy and roadmaps to support silicon node transitions.
• Lead cross-functional planning and execution across silicon, package, and system integration teams.
• Assess technology readiness, identify risks, and implement mitigation plans for design and process challenges.
• Establish validation, qualification, and gate criteria for chip-package integration.
• Coordinate with Fab Process Integration, Product Development, Package Design, Assembly Technology Development, and Global Quality.
• Drive adoption of AI-based workflows to accelerate analysis and decision-making.
• Mentor and guide engineering teams and represent CPI in product and technology reviews.

Requirements

Must-have technical skills and experience to perform the role effectively.

• Proven technical leadership in chip-package interaction, package technology, or silicon integration.
• Experience enabling advanced silicon node transitions and managing associated technical risks.
• Strong cross-functional collaboration and program execution skills across engineering and manufacturing teams.
• Practical experience with validation, qualification, and technology readiness processes.
• Demonstrated proficiency using AI-based tools and workflows for engineering analysis and decision support.
• Excellent written and verbal communication skills for global stakeholder engagement.
• Nice-to-have: hands-on experience with memory products (DRAM/NAND) and package design/assembly technologies.

Education Requirements

Not specified.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.