Package Reliability Engineer (f/m/d)

Job Title

Package Reliability Engineer (f/m/d)

Role Summary

The Package Reliability Engineer will own package-level reliability for packaged products: translate product use cases into mission profiles and FIT/MTBF targets, define and execute qualification plans, lead failure analysis, and provide data-driven release recommendations. The role reports to the Quality & Reliability Program Lead and works closely with Package Architecture, Device Reliability, Product Engineering, and OSAT/laboratory partners.

Experience Level

Mid-level — typically 3–5+ years of relevant semiconductor package reliability experience.

Responsibilities

Accountable for defining reliability strategy, executing qualification and failure analysis, and making evidence-based release decisions.

• Define mission profiles and allocate FIT/MTBF and lifetime targets across package, interconnect, and device contributors.
• Assess package reliability risks and identify package-level failure mechanisms (substrates, die attach, interconnects, solder joints, board attach, optical/fiber interfaces).
• Develop and execute package reliability qualification plans covering thermal, mechanical, environmental, and board-level stress testing according to applicable standards and customer requirements.
• Lead technical interface with OSATs, substrate suppliers, and external labs: set requirements, review data, and challenge insufficient evidence.
• Drive root-cause investigations and failure analysis using X-ray, C-SAM, cross-sectioning, SEM/EDX and translate findings into corrective actions and requalification decisions.
• Develop risk-based qualification strategies for novel packaging technologies (e.g., UBC, optical interconnects) where standards are incomplete.
• Provide clear, data-driven release recommendations for sampling, qualification milestones, and production release, documenting any residual reliability risks.
• Communicate reliability trade-offs and evidence gaps to architects, engineers, suppliers, and leadership.

Requirements

Essential technical skills, standards knowledge, and collaboration experience required to perform the role.

Must-have:

• 3–5+ years evaluating semiconductor package construction and associated failure mechanisms.
• Practical experience with FIT/MTBF calculations, mission-profile development, and acceleration models.
• Experience with qualification standards and test methods (JEDEC, AEC-Q100/Q006, IPC, IEC) and the judgment to apply knowledge-based approaches when standards do not exist.
• Failure analysis proficiency (interpreting X-ray, C-SAM, cross-sections, SEM/EDX) and translating results into risk-based recommendations.
• Proven collaboration with OSATs, substrate suppliers, and external laboratories to define requirements and review qualification data.
• Strong cross-functional communication skills and the ability to document and present technical evidence.

Nice-to-have:

• Experience with high-speed I/O, RF, and optical/photonics reliability and how degradation affects signal integrity and optical performance.
• Experience developing qualification strategies for novel packaging (UBC, optical interconnects) where industry standards are incomplete.
• Startup experience and ability to operate in a fast-paced, resource-constrained environment.

Education Requirements

Master's degree (or equivalent practical experience) in Electrical Engineering, Microelectronics, Materials Science, Reliability Engineering, or a related technical field.

About the Company

Company: Black Semiconductor

Headquarters: Aachen, Germany

Black Semiconductor is revolutionizing the semiconductor industry with innovative graphene solutions that enhance chip connectivity and efficiency. By merging electronic computing and photonic communication, the company aims to reshape how chips interact, driving significant advancements in power and speed. Their human-centered approach fosters collaboration and continuous learning, making it a dynamic place for professionals to grow and make an impact.