Package Reliability Engineer (f/m/d)

Job Title

Package Reliability Engineer (f/m/d)

Role Summary

Lead package-level reliability activities for graphene-enabled semiconductor products. Translate product use cases into mission profiles and FIT/MTBF targets, define and execute qualification plans, run failure analysis, and provide data-driven release recommendations.

Work cross-functionally with Package Architecture, Device Reliability, Product Engineering, and OSAT/lab partners to identify failure mechanisms, close evidence gaps, and drive corrective actions.

Experience Level

Mid-level role. Typical experience: 3–5+ years in package reliability or related semiconductor reliability engineering.

Responsibilities

Define, execute, and close package reliability activities from requirements to release decisions.

• Define mission profiles and allocate FIT/MTBF/lifetime targets across package, interconnect, and device contributors.
• Assess package-level reliability risks across substrates, die attach, interconnects, solder joints, board attach, and optical/fiber interfaces.
• Create and execute qualification plans (thermal, mechanical, environmental, board-level) per JEDEC/AEC-Q/IPC/IEC and customer requirements.
• Lead OSAT, substrate supplier, and lab technical interfaces; review and challenge qualification data and evidence.
• Drive root cause investigations and failure analysis using X-ray, C-SAM, cross-sectioning, SEM/EDX, and translate findings into CAPA/8D and requalification actions.
• Develop risk-based qualification strategies for novel packaging (e.g., UBC, optical interconnects) where standards are incomplete.
• Provide clear, data-driven release recommendations for sampling, qualification milestones, and production readiness.

Requirements

Must-have technical skills and experience for immediate impact.

• 3–5+ years evaluating semiconductor package construction and associated failure mechanisms (substrates, die attach, interconnects, solder joints).
• Deep understanding of high-speed I/O, RF, and optical interface reliability and how degradation affects signal integrity and jitter.
• Practical knowledge of FIT/MTBF calculations, mission profile development, and acceleration models.
• Experience with industry qualification standards and the judgment to apply knowledge-based approaches when standards are insufficient (JEDEC, AEC-Q100/Q006, IPC, IEC).
• Failure analysis skills: interpret X-ray, C-SAM, cross-sectioning, SEM/EDX; convert results into risk-based decisions.
• Proven ability to work with OSATs, substrate suppliers, and external labs to define requirements and evaluate data.
• Clear cross-functional communication skills and experience driving corrective actions and design improvements.
• Comfortable in a startup environment: initiative, ownership, and pragmatic decision-making with limited resources.

Education Requirements

Master's degree in Electrical Engineering, Microelectronics, Materials Science, Reliability Engineering or a related field, or equivalent practical experience.

About the Company

Company: Black Semiconductor

Headquarters: Aachen, Germany

Black Semiconductor is revolutionizing the semiconductor industry with innovative graphene solutions that enhance chip connectivity and efficiency. By merging electronic computing and photonic communication, the company aims to reshape how chips interact, driving significant advancements in power and speed. Their human-centered approach fosters collaboration and continuous learning, making it a dynamic place for professionals to grow and make an impact.