Package Reliability Engineer

Job Title

Package Reliability Engineer

Role Summary

Responsible for ensuring the reliability and manufacturability of 2.5D/3D advanced semiconductor packages through physics-of-failure analysis, material selection, failure analysis, and collaboration with OSATs and internal design/process teams.

The role works cross-functionally with suppliers, assembly/test partners, and internal manufacturing and failure-analysis groups to define test plans, drive corrective actions, and improve yield and robustness.

Experience Level

Mid-level — typically requires 5+ years of hands-on experience in 2.5D/3D advanced packaging reliability.

Responsibilities

Key responsibilities focus on reliability assessment, OSAT collaboration, material qualification, failure analysis, and cross-functional design/process support.

• Perform PoF-based reliability modeling for 2.5D/3D advanced packaging and assess risks from thermal, mechanical, and electrical stressors.
• Define and execute stress-test plans (thermal cycling, humidity, electromigration, etc.) and validate package robustness.
• Manage and collaborate with OSAT partners on reliability qualifications, process optimizations, and corrective actions.
• Evaluate and qualify materials (substrates, dielectrics, adhesives, underfills) and analyze CTE mismatch, warpage, delamination, and adhesion issues.
• Lead failure analysis and root-cause identification using FIB, X-ray, SEM, TEM, C-SAM, X-ray CT, EBSD and related techniques.
• Drive implementation of CAPA with OSATs and internal teams and monitor supplier performance during qualifications and audits.
• Collaborate with design and process teams to define assembly/test vehicles, refine design guidelines, and implement reliability best practices.
• Maintain knowledge of industry standards (JEDEC, IPC, IEEE, MIL-STD) and ensure compliance in reliability methodologies.

Requirements

Must-have technical skills, experience, and eligibility requirements. Preferred items listed separately.

• 5+ years experience in 2.5D/3D advanced packaging reliability, including hands-on work with OSATs.
• Strong understanding of physics of failure (PoF) methodologies for package reliability.
• Proficiency with thermo-mechanical stress modeling tools (ANSYS, Abaqus, COMSOL, or equivalent).
• Practical experience with failure analysis techniques: C-SAM, X-ray CT, SEM, TEM, FIB, EBSD.
• Deep materials science knowledge for interconnects, substrates, interfaces, and related reliability mechanisms.
• Experience defining reliability test plans and driving supplier qualifications and corrective actions.
• Familiarity with JEDEC, IPC, IEEE, and MIL-STD reliability standards.
• Strong analytical, problem-solving, and cross-functional collaboration skills.
• Ability to access export-controlled technology may be required; candidates must be eligible under applicable export control regulations.

Education Requirements

Master's or Ph.D. in Materials Science, Mechanical Engineering, Electrical Engineering, Applied Physics, or a related technical field; equivalent advanced degrees or closely related academic credentials implied by job description.

About the Company

Company: Marvell Technology

Headquarters: Santa Clara, California, United States

Marvell’s semiconductor solutions serve as essential building blocks of the data infrastructure connecting our world, driving innovation across enterprise, cloud, AI, and carrier architectures. The company focuses on creating transformative technology that shapes the future.