Package Pathfinding Architect, MTS

Job Title

Package Pathfinding Architect, MTS

Role Summary

Technical pathfinding role to define long-term packaging technology and system architecture for next-generation memory products. The role sits at the intersection of silicon, packaging, materials, electrical, thermo-mechanical and system performance and partners with customers and internal teams to translate pathfinding ideas into scalable package strategies.

Experience Level

Mid-level; typically requires at least 5 years of relevant industry experience in packaging, electrical simulation, or memory systems.

Responsibilities

Drive package strategy and cross-stack optimization from package to system; develop automation and AI-enhanced tools to improve design efficiency.

• Define next-generation package pathfinding and system architectures to optimize speed, bandwidth, power, capacity, thermal, mechanical, and electrical performance.
• Lead cross-stack co-optimization across silicon, package, board, and system with a package-centric approach.
• Drive long-term memory packaging strategy and influence industry standards.
• Collaborate with silicon, system design teams, business units, and customers to develop disruptive solutions for datacenter and edge-AI memory products.
• Serve as a technical interface to internal partners, customers, and senior leadership.
• Develop AI-based EDA and internal automation toolsets to enhance design-cycle efficiency and measurement automation for incoming substrate materials.

Requirements

Technical must-haves and professional skills required for successful performance in this role.

• Hands-on experience in package design, electrical simulation and analysis using tools such as Ansys, Siemens, and Cadence.
• Extensive experience with memory systems package design, signaling, IO design, and PDN design.
• Deep understanding of memory timing, signaling, power delivery and package process technology.
• Working knowledge of EDA tools for design, analysis, and simulation of electronic packaging.
• Experience applying AI techniques or large language models (LLMs) to improve engineering efficiency.
• Experience with signal and power integrity, thermal, mechanical, and reliability analysis.
• Proficiency in data analysis tools such as Python, MATLAB, or JMP.
• Strong analytical, problem-solving, and communication skills for cross-functional collaboration; detail-oriented with focus on quality and continuous improvement.

Education Requirements

Master's degree or equivalent industry experience in Electrical Engineering, Computer Engineering, Computer Science, or a related technical field is required; PhD in a related technical field is preferred. Equivalent practical experience is accepted.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.