Package Manufacture Engineer, Senior to Staff Level

Job Title

Package Manufacture Engineer, Senior to Staff Level

Role Summary

Senior engineering role in packaging and assembly manufacturing supporting development from concept to production for advanced semiconductor packaging (WLP, Flip Chip, CSP, BGA, SiP, EMIB, CoWoS, CPO, chiplets, data center and ASIC applications).

The role works cross-functionally across design, device process, internal and subcontract packaging groups to drive material and process selection, risk assessment, reliability analysis and production readiness.

Experience Level

Senior level — the posting specifies 10+ years of relevant semiconductor packaging or manufacturing experience.

Responsibilities

Primary responsibilities include technical development, process control and cross-functional coordination to move packaging technologies into production.

• Develop and validate substrate and assembly processes for bumping, wafer-level packaging, flip chip, underfill, heat spreaders, and related process steps.
• Perform material and design selection, technical risk assessment, mitigation planning and transfer to production.
• Establish and maintain SPC, control plans, OCAPs, FMEAs, and CAPA/PCN processes for assembly lines.
• Analyze yield, cycle time and cost; lead continuous improvement and root-cause failure analysis.
• Collaborate with design, device process development, test houses and suppliers to qualify components and turnkey flows.
• Document and communicate technical requirements, KPIs and production readiness criteria to stakeholders.

Requirements

Must-have technical skills, tools and attributes for successful candidates.

• Must-have: 10+ years of experience in semiconductor packaging engineering or manufacturing with deep understanding of packaging requirements, process capability and equipment capability.
• Must-have: Familiarity with yield management, continuous improvement, assembly cycle time analysis and cost reduction.
• Must-have: Practical experience with data analysis tools (Excel, JMP) and basic scripting or automation (Excel VBA).
• Must-have: Good understanding of chip-level and package-level reliability and failure analysis methodology.
• Must-have: Fluent in English and Mandarin (spoken and written); proactive attitude and ability to handle new challenges.
• Nice-to-have: Experience with Tableau, yield management software (O+), knowledge of RMA/quality concepts, and familiarity with foundry processes and turnkey/test-house models.

Education Requirements

Preferred: Master’s degree in Electrical Engineering, Physics, Materials Science, or related discipline. Acceptable alternatives provided in the posting: Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field (with 4+ years relevant hardware engineering experience); or Master’s degree with 3+ years; or PhD with 2+ years. Wide-spectrum bachelor candidates may be considered and equivalent practical experience is implied by the degree/experience alternatives.

About the Company

Company: Qualcomm

Headquarters: San Diego, California, United States

Qualcomm is a global leader in semiconductor and telecommunications equipment, specializing in mobile technologies and innovations. Known for its Adreno GPUs, the company provides solutions enabling advancements in mobile gaming, AI, VR/AR, and autonomous driving. Qualcomm's cutting-edge technology and commitment to high-performance, power-efficient designs drive the evolution of mobile graphics and connectivity worldwide.