Package Health Test (Senior/Staff/Principal) Engineer, APTD

Job Title

Package Health Test (Senior/Staff/Principal) Engineer, APTD

Role Summary

Develop and execute package health monitoring, simulation, characterization, and reliability testing to ensure robust packaging solutions for high-performance memory products (including HBM). Work within Advanced Packaging Technology Development (APTD) to define test architecture, improve probe yields, and validate test vehicles for transfer to manufacturing.

Experience Level

Senior-level (Senior/Staff/Principal). The posting specifies a minimum of 2+ years of semiconductor industry experience.

Responsibilities

Accountable for test architecture, characterization, failure analysis, and readiness of test vehicles and customer test flows.

• Develop test architecture, strategies, and coverage focused on yield and probe performance for advanced packages.
• Define, validate, and optimize test coverage for wafer- and die-level processes.
• Perform electrical characterization and failure analysis of advanced packages, including HBM.
• Identify needs and co-develop new DFTs with cross-functional teams.
• Enhance test-fail debugging capabilities to meet probe yield targets.
• Contribute to the APTD product roadmap from a test architecture perspective.
• Collaborate on Test Vehicle validations and probe coverage readiness.
• Coordinate customer test flow readiness activities with external partners.

Requirements

Must-have skills and experience. See Education Requirements for degree expectations.

• 2+ years of semiconductor industry experience, preferably in product, packaging, or test engineering.
• Experience defining test architectures, coverage, and managing test/probe yield.
• Strong knowledge of product testing, test architecture, and packaging failure modes.
• Hands-on experience with simulation tools, test equipment, package characterization, and electrical failure analysis.
• Proficiency in data analysis, statistics, AI/ML tools, and scripting (examples: Python, MATLAB, JMP).
• Proven problem-solving, multitasking, and effective written and verbal communication skills.

Education Requirements

Bachelor's or Master's degree in Electrical Engineering or a related field (the posting specifies "Bachelor’s or Master’s degree in Electrical Engineering, or related field"). No certifications or explicit "equivalent experience" language were provided in the posting.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.