Package Failure Analysis Engineer

Job Title

Package Failure Analysis Engineer

Role Summary

Perform root-cause failure analysis and characterization of assembled semiconductor packages to support yield improvement and in-line failure resolution. Work in a lab-based environment with engineers, technicians, and internal customers to isolate electrical failures and identify defect/process mechanisms.

Collaborate across teams to align priorities, share technical findings, and recommend corrective actions to manufacturing and program stakeholders.

Experience Level

Entry-level / Early Career. Typical candidate profile: 1–3 years of relevant industry or lab experience when holding a Bachelor's degree; candidates with a Master's or PhD are also considered.

Responsibilities

Hands-on lab and analytical responsibilities to support package yield and reliability.

• Perform hands-on failure analysis and laboratory testing to isolate electrical and material failures.
• Define data acquisition strategies, analyze results, and recommend corrective actions to internal customers.
• Develop and document failure-analysis techniques, best-known methods (BKMs), and approaches to accelerate root-cause identification.
• Interface with yield, integration, module partners, and program teams to meet milestones and deliverables.
• Respond to customer requests and production events; provide technical consultation on packaging and assembly issues.
• Work collaboratively across organizational boundaries with engineers and technicians.

Requirements

Must-have technical and eligibility criteria. Preferred skills listed separately.

• Must-have: US Citizenship is required.
• Must-have: Ability to obtain and maintain a US Government TS/SCI security clearance with polygraph.
• Must-have: Lab-based, on-site work in Phoenix; ability to perform hands-on testing and diagnostics.
• Must-have: Strong analytical, problem-solving, communication, and presentation skills.
• Preferred / Nice-to-have: Active TS/SCI with polygraph.
• Preferred / Nice-to-have: Experience with optical and electron analysis (SEM, TEM, x-ray, optical microscopy).
• Preferred / Nice-to-have: Practical exposure to electrical diagnostics and probing (multimeters, TDR, EOTPR, EBAC, RIDR, ELITE).
• Preferred / Nice-to-have: Experience with chemical/compositional analysis (EDX, AFM, FTIR, Raman, XRD, EBSD).
• Preferred / Nice-to-have: Familiarity with CAD tools and basic statistical analysis (e.g., JMP).

Education Requirements

Bachelor's degree (with 1–3 years of relevant experience), or a Master’s or PhD in Materials Science and Engineering, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Chemistry, Physics, or a related technical field.

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.