Package Engineering (PEPkg) Engineer

Job Title

Package Engineering (PEPkg) Engineer

Role Summary

Responsible for package development, qualification, and customer support to ensure successful product release and sustainment of DRAM and NAND packages. Role is based in the Package Engineering team at Micron's Taichung Fab 16.

Work focuses on qualification, release, and ongoing support of memory package products and cross-functional collaboration to meet customer and product requirements.

For application assistance or accommodations, contact hrsupport_taiwan@micron.com.

Experience Level

Mid-level. Years of experience not specified.

Responsibilities

Primary responsibilities include:

• Develop and qualify DRAM and NAND package designs and processes.
• Plan and execute package qualification testing and analyze results.
• Provide technical support to internal teams and external customers for product release and sustainment.
• Troubleshoot package-related failures and implement corrective actions.
• Coordinate with design, test, reliability, manufacturing, and quality teams to meet release milestones.
• Maintain specifications, qualification reports, and related documentation.

Requirements

Information not specified in the posting.

Education Requirements

Not specified.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.