Package Engineer
Delos DataJob Title
Package Engineer
Role Summary
Senior packaging engineer responsible for architecting and delivering advanced multi-die IC packages for high-performance AI accelerators. The role partners with IC design, physical design, SI/PI, board teams, and external foundries/OSATs to meet electrical, thermal, mechanical, and manufacturability targets.
Experience Level
Senior-level. Specific years of experience not stated.
Responsibilities
Design and deliver package solutions that meet system-level performance, thermal, and manufacturability requirements.
- Select and define multi-die package types (MCM, 2.5D, 3D, fan-out, CoWoS, InFO, CPC, CPO) balancing electrical performance, thermal behavior, cost, and manufacturability.
- Define package specifications including bump/ball maps, interposer requirements, mechanical constraints, substrate stack-ups, bump/ball pitch, routing and via structures.
- Perform high-speed signal escaping, routing, and power distribution network design and verification.
- Manage subcontractors and engage directly with TSMC and OSAT partners on bumping, substrate options, and advanced packaging flows.
- Partner with IC design, physical design, SI/PI, and board teams to align package requirements with system needs.
- Support package-level bring-up, failure analysis, debug, and qualification.
- Evaluate emerging packaging technologies and drive adoption for next-generation products.
Requirements
Must-have technical skills and experience to perform the role; nice-to-have items noted.
- Experience with multi-die package design and UCIe (AP/SP) integration.
- Understanding of substrate materials, stack-ups, mechanical constraints, and manufacturability considerations.
- Familiarity with SI/PI concepts to collaborate effectively with electrical teams.
- Experience managing packaging subcontractors and coordinating with foundries/OSATs.
- Experience interfacing with TSMC or similar foundries on bumping and packaging options.
- Experience in high-speed signal escaping, routing, and PDN design.
- Nice-to-have: familiarity with package modeling tools (HFSS, Sigrity, or similar).
Education Requirements
B.S. or M.S. in Electrical Engineering or a related field.
About the Company
Company: Delos Data
Headquarters: Palo Alto, CA, United States
Stealth-mode Silicon Valley startup building foundational technology to improve performance, scalability, and resiliency of large-scale AI data center clusters. Backed by venture capital and led by experienced founders, the company develops hardware/software solutions and operates across U.S. and Canadian locations.
