Package Development, Signal Integrity and Power Integrity Staff to Senior Staff Engineer

Job Title

Package Development, Signal Integrity and Power Integrity Staff to Senior Staff Engineer

Role Summary

Member of Marvell's central packaging engineering team responsible for electrical design, modeling, and characterization of advanced IC packages targeting very high data rates. The role drives signal integrity (SI) and power integrity (PI) across package development, interfaces with IC designers and suppliers, and ensures manufacturability and performance.

Work focuses on high-speed package architectures (including multi-chip and multi-component configurations) and cross-functional execution from concept through production.

Experience Level

Senior-level (Staff to Senior Staff). The posting specifies 5–10 years of related professional experience.

Responsibilities

Key responsibilities include:

• Design, model, and characterize high-speed IC packages to meet electrical performance targets (signal and power integrity).
• Perform EM, SI and PI simulation and validation using 2D/3D tools and circuit simulators; support measurement and characterization.
• Work with package suppliers to select technologies, drive layout, and ensure manufacturability, reliability, and cost targets.
• Define achievable package specifications jointly with IC designers and marketing; contribute to new package technology development.
• Manage cross-functional execution with assembly, IC physical layout, analog/digital design teams, and manufacturing partners.
• Automate SI/PI and packaging workflows using scripting (for example, Python).
• Investigate and mitigate EMI/EMC issues and support channel and system-level signal analysis.
• Document results, present findings, and communicate technical tradeoffs to stakeholders.

Requirements

Must-have and preferred technical skills and experience.

• Must-have: Strong fundamentals in electromagnetics, transmission lines, and microwave theory.
• Proven experience with 2-D and 3-D EM simulation tools such as Ansys HFSS, SIwave, or Cadence Clarity.
• Experience with package layout tools (e.g., APD or PADS) and power plane design tools (e.g., PowerSI, SIwave).
• Knowledge of circuit design and simulation tools such as Spectre, ADS, or HSpice.
• Frequency-domain and time-domain expertise in high-speed signaling and channel behavior.
• Practical experience in high-speed electronic packaging for digital and analog ICs and familiarity with packaging technologies, materials, substrate design rules, and assembly rules.
• Ability to manage multi-disciplinary development projects and collaborate across engineering and supply-chain teams.
• Proficiency in scripting to automate SI/PI and packaging workflows (Python preferred); strong communication and documentation skills.
• May require eligibility to access export-controlled technology; export license review may apply.
• Nice-to-have: Track record of new product introduction, thermal/mechanical package analysis, channel simulation experience (MATLAB or ADS), and hands-on 2.5D/3D package development.

Education Requirements

Bachelor's, Master's, or PhD in Computer Science, Electrical Engineering, or a related technical field. The posting specifies 5–10 years of relevant professional experience in addition to the degree requirement.

About the Company

Company: Marvell Technology

Headquarters: Santa Clara, California, United States

Marvell’s semiconductor solutions serve as essential building blocks of the data infrastructure connecting our world, driving innovation across enterprise, cloud, AI, and carrier architectures. The company focuses on creating transformative technology that shapes the future.