Package Development, Signal Integrity and Power Integrity Engineer, Principal

Job Title

Package Development, Signal Integrity and Power Integrity Engineer, Principal

Role Summary

Develop and validate high-speed IC package solutions (targeting 448 Gb/s and beyond) with responsibility for signal integrity (SI), power integrity (PI), electrical modeling, and characterization. Work spans package electrical design, manufacturability, supplier collaboration, and cross-functional coordination with IC designers and marketing to define achievable package specifications.

Experience Level

Senior-level. Typical experience guidance: 5+ years of relevant industry experience (see Education Requirements for degree-specific ranges).

Responsibilities

The engineer will execute package electrical design and verification, drive supplier and internal alignment, and deliver validated package solutions to production.

• Lead SI and PI analysis, modeling, and verification for advanced IC packages.
• Create and validate 2D/3D EM models and transmission-line representations for package and channel behavior.
• Perform measurements and characterization (VNA, TDR) and correlate with simulation.
• Design and review package layouts, ensuring manufacturability and compliance with substrate and assembly rules.
• Collaborate with package suppliers, assembly, IC layout, analog/digital designers, and marketing to define and meet performance and cost targets.
• Automate SI/PI and packaging workflows using scripting (e.g., Python) and integrate tools into development flow.
• Support new package technology evaluation and new product introductions from development through production.

Requirements

Core technical skills and practical experience required; optional items listed as preferred.

Must-have:

• Strong fundamentals in electromagnetics, transmission lines, and microwave theory.
• Experience with 2D/3D EM simulation tools such as Ansys HFSS, SIwave, Cadence Clarity.
• Practical experience with VNA and TDR measurements and correlating measurements to models.
• Working knowledge of circuit/signal simulation tools (Spectre, ADS, HSpice).
• Experience in high-speed electronic packaging for digital and analog ICs and high-speed signaling (time and frequency domain).
• Power plane design, modeling, and analysis using tools like PowerSI or SIwave.
• Familiarity with IC package layout tools (APD, PADS) and package substrate design/assembly rules.
• Ability to coordinate cross-functional development activities and communicate results clearly.

Nice-to-have:

• Experience with 2.5D/3D package development and co-packaged optics.
• Track record of new product introduction and production transition.
• Thermal and mechanical analysis experience for packages, and channel simulations using MATLAB or ADS.
• Experience debugging EMI/EMC problems.

Education Requirements

Bachelor's degree in Computer Science, Electrical Engineering, or a related field with approximately 5–8 years of relevant professional experience; or Master’s/PhD in Computer Science, Electrical Engineering, or a related field with approximately 1–3 years of relevant professional experience.

About the Company

Company: Marvell Technology

Headquarters: Santa Clara, California, United States

Marvell’s semiconductor solutions serve as essential building blocks of the data infrastructure connecting our world, driving innovation across enterprise, cloud, AI, and carrier architectures. The company focuses on creating transformative technology that shapes the future.