Package Designer

Job Title

Package Designer

Role Summary

Design, verify, and validate new semiconductor package products as part of an advanced packaging team. Work focuses on developing heterogeneous packaging technologies and supporting the full package development cycle from concept through validation.

Experience Level

Mid-level. Typical expectation per posting: ~5 years of relevant experience with a B.S. in Engineering, or ~4 years with a Master of Engineering.

Responsibilities

Primary responsibilities include hands-on package design and verification plus teamwork to advance packaging technology.

• Develop new package designs for heterogeneous semiconductor assemblies.
• Perform design verification and validation activities.
• Create and maintain design documentation and drawings.
• Collaborate with cross-functional teams (electrical, mechanical, test, process) to integrate packages into products.
• Support prototype bring-up and troubleshoot package-related issues.

Requirements

Technical skills and tooling experience required for the role.

• Hands-on experience with Cadence APD/Allegro.
• Experience using AutoCAD for package/board drawings.
• Proficiency with scripting for automation and tool integration (examples: VBS, SKILL, Python).
• Practical experience in package design, verification, or validation workflows.
• Ability to work effectively in a team developing advanced packaging technologies.

Education Requirements

B.S. in Engineering (with approximately 5 years of relevant experience) or Master of Engineering (with approximately 4 years of relevant experience) as stated in the posting.

About the Company

Company: Chipletz

Headquarters: Austin, TX, USA

Chipletz develops advanced semiconductor packaging and heterogeneous integration solutions, focusing on chiplet-based packages, design verification, and validation for high-performance electronics.