Package Design Engineering - Director

Job Title

Package Design Engineering - Director

Role Summary

Lead assembly sustaining engineering and high-volume manufacturing for advanced semiconductor packaging technologies, focusing on power packaging for AI/data center infrastructure and wide-bandgap devices. This role manages yield, process stability, quality, change control, NPI-to-HVM transfers, and global OSAT partnerships.

The position partners with Package Engineering, R&D, Product Engineering, Quality, Supply Chain, and external OSATs to translate development intent into stable, cost-competitive high-volume production.

Experience Level

Senior — typically requires 12+ years in semiconductor manufacturing and packaging engineering with 5+ years of engineering leadership experience.

Responsibilities

The director will drive manufacturing performance, sustainment, and ramp execution across assembly technologies and global manufacturing partners.

• Lead sustaining engineering for semiconductor package assembly product lines and technologies.
• Drive HVM performance: yield, cycle time, throughput, quality, and cost.
• Establish process control, SPC, defect reduction, DOE, and continuous improvement systems.
• Own yield monitoring, trend analysis, corrective actions, and KPI/dashboard definition.
• Resolve process, reliability, and customer quality issues via root-cause analysis.
• Manage process change control, qualifications, and manufacturing readiness for transfers and equipment changes.
• Serve as manufacturing interface for NPI-to-production transfers and structured ramp execution.
• Manage global OSAT and contract manufacturing relationships, audits, and partner accountability.
• Build and develop a high-performing, distributed assembly engineering team and drive talent development.

Requirements

Must-have technical skills, operational experience, and leadership capabilities.

• 12+ years in semiconductor manufacturing and packaging engineering, with significant IC assembly and NPI-to-HVM exposure.
• 5+ years leading engineering teams in semiconductor manufacturing environments.
• Deep expertise in assembly processes (wirebond, flip-chip, wafer-level packaging, multi-chip modules, molding, singulation, SMT) and advanced packaging technologies.
• Experience with power packaging: Smart Power Stages, Vertical Power Stages, Power Modules, Discrete FET packages; familiarity with SiC/GaN, DBC, and AMB is valued.
• Strong skills in yield analysis, SPC, DOE, process control, qualification methods, and statistical analysis tools.
• Proven track record of managing global OSAT/outsourced manufacturing, vendor qualification, and partner technical management.
• Demonstrated success executing NPI-to-HVM ramps and manufacturing readiness plans.
• Knowledge of quality systems, containment/corrective/preventive actions, and change management.
• Excellent analytical, organizational, communication, and cross-functional leadership skills.
• Nice-to-have: experience with advanced packaging (2.5D/3D, SiP, fan-out, embedded die, heterogeneous integration), automotive or data-center power product requirements, and familiarity with reliability standards (JEDEC, IPC).

Education Requirements

Bachelor's degree in Electrical Engineering, Materials Science, Mechanical Engineering, Chemical Engineering, or a related technical discipline is required. A Master’s degree or PhD in engineering or a related field is preferred.

About the Company

Company: Renesas

Headquarters: Hitachinaka, Japan

Renesas is a global leader in embedded semiconductor solutions, providing high-quality products across automotive, industrial, infrastructure, and IoT sectors. With over 22,000 employees in more than 30 countries, the company focuses on scalable solutions that enhance user experience and drive innovation while committed to sustainability and energy efficiency.