Package Design Engineer — Semiconductor

Job Title

Package Design Engineer — Semiconductor

Role Summary

Design advanced semiconductor packages (ceramic and organic substrates) for Micross facilities in Apopka, FL or Raleigh, NC. Collaborate with IC, system, SI/PI and thermal teams to define package requirements, optimize die floorplans and create manufacturable layouts.

Experience Level

Senior — typically 8 to 10 years of experience in semiconductor packaging design, modeling, and simulation.

Responsibilities

Primary responsibilities include package architecture, layout, parasitic extraction and documentation.

• Design custom interposers and substrates, including layout and stack-up definition.
• Collaborate with SoC and IC teams to optimize die floorplan, bump patterns and package/IC interface.
• Perform parasitic extraction and package-level SI/PI analysis and optimization.
• Run thermal and power integrity analysis and support trade studies.
• Prepare fabrication artwork and release design documentation into archival systems.

Requirements

Key technical skills and experience required. Degrees are listed separately under Education Requirements.

• Must-have: Extensive hands-on experience with Cadence Allegro Package Designer Plus (APD+).
• Must-have: Proven experience with interposer and substrate layouts and advanced package technologies (2.5D and 3D).
• Must-have: Strong experience with package-level SI/PI tools and workflows (parasitic extraction, IR drop, impedance profiling).
• Must-have: Practical experience performing package parasitic extraction and PI/SI analysis using industry tools.
• Nice-to-have: Experience with Celsius PowerDC, Sigrity Advanced SI/PI toolsets, and EM/RF tools such as AWR, Momentum or HFSS.
• Nice-to-have: History of successful cross-functional collaboration and documented problem-solving on complex packaging projects.

Education Requirements

Bachelor's degree in Electrical Engineering, Mechanical Engineering, or another semiconductor packaging–related discipline.

About the Company

Company: Micross

Micross provides microelectronic packaging, engineering, assembly, testing and supply-chain services for advanced semiconductor and electronic components. They support custom package design, interposers, substrates, and related solutions for aerospace, defense and commercial markets.