Package Design Engineer

Job Title

Package Design Engineer

Role Summary

Design and deliver complex flip-chip BGA ASIC packages with attention to signal integrity, power integrity, manufacturability, reliability, and thermal performance. Work on high-performance designs used in AI, networking, HPC, and 5G applications.

Member of a worldwide R&D package engineering team that collaborates with internal silicon, board, and vendor teams to enable high-speed SerDes, ADC/DAC, HBM, DDR5, and high-power solutions.

Experience Level

Senior-level engineer. See Education Requirements for specific years-of-experience criteria.

Responsibilities

Key responsibilities include:

• End-to-end ASIC package design and engineering for flip-chip BGA packages.
• Address signal integrity, power integrity, thermal, reliability, and manufacturability requirements in package designs.
• Design critical structures for SerDes, ADC/DAC, DDR, and related subsystems.
• Perform physical design/layout as a foundational task.
• Manage multiple projects, prioritize tasks, and track schedules across concurrent assignments.
• Act as project liaison with internal stakeholders and external vendors.
• Improve team efficiency through process development, automation, and documentation.

Requirements

Must-have technical skills and work habits:

• Practical knowledge of package-level signal integrity and power integrity applied to package designs.
• Experience with flip-chip BGA package design and engineering.
• Experience with Cadence APD/Allegro Package Designer or equivalent package design tools.
• Proven ability to collaborate across multiple time zones with internal and vendor teams.
• Strong self-management, organization, and project-tracking skills.
• Willingness and ability to work on-site full time at the company office.

Nice-to-have:

• Experience writing Cadence SKILL or similar design-automation/scripting for Allegro or other EDA flows.
• Prior work on very-high-speed SerDes (e.g., 224G and above), HBM, or DDR5-related package work.

Education Requirements

Bachelor of Science in Electrical Engineering (BSEE) or similar field with 8+ years of flip-chip BGA package design experience, or Master of Science in Electrical Engineering (MSEE) or similar field with 6+ years of relevant experience. Equivalent practical experience may be considered where stated.

About the Company

Company: Broadcom

Headquarters: Irvine, California, United States

Broadcom is a global technology leader that designs, develops, and supplies a wide range of semiconductor and infrastructure software solutions. The company is known for its innovations in wireless and broadband communications, enabling a connected world.