Package Design Engineer

Job Title

Package Design Engineer

Role Summary

Responsible for electrical and mechanical design of advanced semiconductor packages for high-speed optical interconnect and networking products. Works across signal integrity, thermal, mechanical, silicon photonics and manufacturing teams to take package concepts through layout, prototyping, and qualification to manufacturing.

Experience Level

Senior — typically 10+ years of semiconductor package design experience.

Responsibilities

Design and deliver advanced package solutions that meet electrical, thermal, mechanical, and manufacturability targets.

• Own package architecture and floorplanning for FCBGA/FCCSP, organic substrates, silicon interposers, and 2.5D/3D integrations.
• Develop high-density substrate routing and controlled-impedance interconnect for 112G/224G (and preferably 400G) interfaces.
• Perform transmission-line design, differential pair routing, via optimization, and return-current-path management for high-speed interfaces.
• Define package stack-ups, design rules, and layout guidelines with signal/power integrity and thermal teams.
• Address reliability early in design: warpage, thermo-mechanical stress, underfill selection, and solder-joint considerations.
• Collaborate with silicon photonics, optical, and assembly teams on light coupling, fiber attach, and alignment impacts.
• Drive design reviews, tolerance analyses, DFM/DFX assessments with substrate vendors, OSATs, and manufacturing teams.
• Support prototyping, bring-up, qualification, and resolution of design issues; capture lessons learned for future designs.

Requirements

Must-have technical skills and experience for immediate contribution.

• 10+ years of experience in semiconductor package design for high-speed networking, datacenter, or optical products.
• Proven experience with advanced package technologies: FCBGA/FCCSP, organic substrates, silicon interposers, 2.5D/3D packaging, and flip-chip assembly.
• Practical experience with high-density substrate routing and controlled-impedance interconnect.
• Experience designing for 112G and 224G interfaces; 400G experience preferred.
• Strong understanding of transmission-line design, differential pair routing, via optimization, and return-current paths.
• Knowledge of package reliability drivers (warpage, thermo-mechanical stress, underfill, solder joints) and how to mitigate them in design.
• Experience collaborating with substrate vendors, OSATs, and internal manufacturing teams.
• Strong communication and cross-functional leadership skills to drive design reviews and manufacturability decisions.

Nice-to-have:

• Experience with silicon photonics packaging, Co-Packaged Optics (CPO), Optical I/O, or pluggable optical modules.
• Familiarity with laser/photodiode/fiber attach and optical alignment considerations.
• Knowledge of interfaces such as UCIe, PCIe, Ethernet, and CXL.
• Experience packaging AI accelerators or networking ASICs and advanced cooling solutions.

Education Requirements

MS or PhD in Electrical Engineering, Mechanical Engineering, Packaging Engineering, or a related discipline preferred. A BS with extensive relevant experience may be considered; equivalent practical experience acceptable.

About the Company

Company: GlobalFoundries

Headquarters: Saratoga Springs, New York, USA

GlobalFoundries is a leading contract manufacturer for the global semiconductor industry, with facilities in multiple countries, including the USA. The company develops a broad portfolio of semiconductor technologies and employs around 13,000 people worldwide. GlobalFoundries focuses on enhancing competitiveness in specialized application solutions and fostering innovation in mobile communications, consumer electronics, and automotive applications.