Package Design Engineer
BroadcomJob Title
Package Design Engineer
Role Summary
Design and deliver flip-chip BGA packages for high-performance ASICs used in AI, networking, HPC and 5G. Work as part of a worldwide R&D package engineering team to develop package structures that meet signal integrity, power integrity, thermal, manufacturability and reliability targets.
Experience Level
Mid-level. Typical experience expectations vary by degree: see Education Requirements for specific years (commonly 3+ to 5+ years).
Responsibilities
Primary responsibilities include package layout, routing and engineering for high-speed and RF-enabled ASIC packages.
- Lead overall ASIC package layout and routing, addressing impedance matching, crosstalk, signal integrity, power integrity, manufacturability, reliability and thermal considerations.
- Design critical high-frequency / high-data-rate structures for SerDes, ADC/DAC, DDR, HBM and similar interfaces.
- Coordinate, prioritize and track work across multiple simultaneous projects and schedules.
- Collaborate with internal teams and external vendors across multiple time zones on package co-design and implementation.
Requirements
Must-have technical skills and collaborative abilities; preferred items listed separately.
- Proven experience in flip-chip BGA package design including high-speed SerDes implementation.
- Practical knowledge of package-level signal integrity and power integrity applied to package designs.
- Familiarity with impedance control, crosstalk mitigation, thermal and reliability considerations for packages.
- Strong organizational and task-management skills to manage multiple package design projects.
- Ability to work effectively with global teams and external vendors across multiple time zones.
- Preferred: Cadence APD (Allegro Package Designer) or equivalent package design tools.
- Preferred: Experience with 2.5D and 3DIC package technologies.
Education Requirements
B.Eng (EE/EEE) or similar field with typically 5+ years of flip-chip BGA package design experience, or M.Eng (EE/EEE) or similar field with typically 3+ years. Preferred experience levels: B.Eng 8+ years or M.Eng 6+ years for stronger candidates. Fields cited: Electrical Engineering / Electronic & Electrical Engineering or similar technical disciplines.
About the Company
Company: Broadcom
Headquarters: Irvine, California, United States
Broadcom is a global technology leader that designs, develops, and supplies a wide range of semiconductor and infrastructure software solutions. The company is known for its innovations in wireless and broadband communications, enabling a connected world.
