Package Assembly Low Yield Analysis Engineer on Shift
Work as an on-shift engineer in a foundry back-end package assembly failure analysis (LYA) lab. Perform hands-on electrical and physical characterization, test, and root-cause analysis of assembly and wafer-level failures to identify yield loss mechanisms and recommend corrective actions.
The role supports cross-functional teams, suppliers, and customers to drive yield improvements and sustain product assembly processes. This position is lab-based and requires on-site shift work (Shift 7, compressed back-half schedule).
Entry-level / College graduate. Suitable for recent graduates or candidates with limited professional experience; specific equipment experience expectations are listed below.
Primary duties include technical analysis, lab execution, and cross-team support to identify failure mechanisms and improve yield.
Must-have skills and experience required for initial consideration; preferred items are listed as nice-to-have.
Bachelor's degree or higher in Materials Science and Engineering, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Chemistry, Physics, or a related technical field. Equivalent practical experience or relevant coursework/internships/military training may also satisfy this requirement.
Company: Intel Corporation
Headquarters: Santa Clara, California, USA
Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.
