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Package Assembly Low Yield Analysis Engineer on Shift

Intel Corporation
June 03, 2026
Full-time
On-site
Phoenix, Arizona, United States
$85,200 - $139,810 USD yearly
Test Engineering Jobs, Level - Entry or Early Career

Job Title

Package Assembly Low Yield Analysis Engineer on Shift

Role Summary

Work as an on-shift engineer in a foundry back-end package assembly failure analysis (LYA) lab. Perform hands-on electrical and physical characterization, test, and root-cause analysis of assembly and wafer-level failures to identify yield loss mechanisms and recommend corrective actions.

The role supports cross-functional teams, suppliers, and customers to drive yield improvements and sustain product assembly processes. This position is lab-based and requires on-site shift work (Shift 7, compressed back-half schedule).

Experience Level

Entry-level / College graduate. Suitable for recent graduates or candidates with limited professional experience; specific equipment experience expectations are listed below.

Responsibilities

Primary duties include technical analysis, lab execution, and cross-team support to identify failure mechanisms and improve yield.

  • Plan and execute hands-on lab tests and failure analyses for package and assembly issues.
  • Design and modify test setups, define data acquisition strategies, and analyze results.
  • Perform electrical fault isolation and support characterization to determine root cause of in-line failures.
  • Develop and document best known methods (BKMs), techniques, and corrective action recommendations.
  • Coordinate with shift technicians, engineers, yield teams, integration, and external suppliers.
  • Provide technical consultation and incident response to internal customers as events occur.
  • Communicate findings through reports and presentations to stakeholders.

Requirements

Must-have skills and experience required for initial consideration; preferred items are listed as nice-to-have.

  • Must-have: 3+ months hands-on experience with electron microscopy or other characterization/fault isolation tools (e.g., SEM, TEM) obtained via work, internships, or coursework.
  • Must-have: Ability to perform lab work safely and reliably in an on-site shift environment (Shift 7 compressed schedule).
  • Experience with electrical fault isolation tools and techniques (hand probe, curve tracer, auto probing, TDR, EBAC, etc.) is expected or developed on the job.
  • Strong analytical and problem-solving skills, with attention to data collection and interpretation.
  • Good verbal and written communication skills for reporting results to engineers and customers.
  • Nice-to-have: Experience with destructive/optical analysis (cross-sectioning, delayering, X-ray, CSAM, FIB), chemical compositional analysis (EDX, AFM, FTIR, Raman), and statistical/data tools (JMP, SQL scripting).
  • Nice-to-have: Familiarity with package/die mapping tools (Mentor Graphics, SysNav/CadNav, FIELD).

Education Requirements

Bachelor's degree or higher in Materials Science and Engineering, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Chemistry, Physics, or a related technical field. Equivalent practical experience or relevant coursework/internships/military training may also satisfy this requirement.


About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.

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Date Posted: 2026-06-04