Package Assembly Low Yield Analysis Engineer

Job Title

Package Assembly Low Yield Analysis Engineer

Role Summary

Responsible for electrical-characterization and failure analysis of back-end package and wafer-level assemblies to identify root causes of yield loss and in-line failures. Works in a lab-based, on-site team supporting assembly sort/test fails and interfaces with technicians, yield engineers, suppliers, and module partners.

Position operates on a compressed Shift 7 (back-half days) schedule and includes hands-on test, characterization, and cross-functional coordination.

Experience Level

Entry-level / College graduate. Early-career role; candidates typically have limited professional experience. Minimum practical experience: 3+ months with electron microscopy or similar characterization/fault isolation tools.

Responsibilities

Key responsibilities include:

• Design, test, checkout, modify, and characterize assembly technologies and tests.
• Conduct hands-on lab work; define data acquisition and analysis plans; recommend corrective actions.
• Perform failure analysis and electrical fault isolation to provide root-cause determinations for in-line failures.
• Develop and document failure analysis techniques, best-known-methods, and approaches to accelerate identification.
• Provide package design, development, and sustaining support for assemblies and electronic components.
• Coordinate across teams and with external suppliers to meet program milestones and improve yield.
• Respond to customer requests/events and communicate findings through reports and presentations.

Requirements

Must-have technical skills and experience (minimums listed first):

• 3+ months experience with electron microscopy or other characterization/fault isolation tools (e.g., SEM, TEM).
• Hands-on lab experience with destructive and optical analysis techniques (cross-sectioning, delayering, SEM, x-ray, CSAM, ion milling, FIB, TEM) preferred.
• Experience performing electrical fault isolation and failure analysis using tools such as hand probe, curve trace, auto probing, TDR, EOTPR, EBAC, RIDR, and/or ELITE preferred.
• Familiarity with chemical compositional analysis (EDX, AFM, FTIR, Raman) and diffraction techniques (XRD, EBSD) preferred.
• Experience with package/die mapping software (e.g., Mentor Graphics, SysNav/CadNav, FIELD), SQL scripting, and basic statistical analysis tools such as JMP is a plus.
• Strong analytical and problem-solving skills, robust communication and presentation skills, and the ability to work collaboratively and adapt to changing priorities.
• Ability to work the required on-site Shift 7 compressed schedule in a lab environment.

Education Requirements

Master's degree or higher in Materials Science and Engineering, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Chemistry, Physics, or a related technical field; equivalent practical experience may be considered.

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.