Package Assembly Integration Engineer

Job Title

Package Assembly Integration Engineer

Role Summary

Drive development, qualification, and transfer of EMIB package assembly processes for high-volume manufacturing. Work with product engineering, module engineering, suppliers, and fabrication teams to create integrated process solutions that meet safety, quality, reliability, cost, yield and productivity targets.

This role requires regular onsite presence at the Phoenix, AZ facility and focuses on process characterization, FMEA/feasibility studies, data-driven problem resolution, and technology transfer to manufacturing.

Experience Level

Mid-level (Level - Mid-Career). Typical experience expectation: approximately 5+ years industry experience with a Bachelor's or 3+ years with a Master's (see Education Requirements for degree details).

Responsibilities

Core responsibilities include process development, qualification, and cross-functional execution:

• Plan and conduct experiments to characterize and improve assembly processes throughout development.
• Perform feasibility and FMEA studies to define integrated process solutions and risk mitigation.
• Select and develop materials and equipment to meet quality, reliability, cost, yield and manufacturability goals.
• Identify and resolve customer or manufacturing issues by partnering with product and module engineering teams.
• Lead new product qualification and technology transfers from development to high-volume manufacturing.
• Use data analysis to identify process or tool weaknesses and propose corrective, evidence-based actions.
• Collaborate with suppliers and internal partners to meet technology roadmaps and production needs.
• Manage schedules and detailed build plans for multiple products/projects in parallel.

Requirements

Must-have technical skills and experience; preferred items noted separately.

• Industry experience in EMIB package assembly, substrate design, or manufacturing.
• Experience with process characterization, experiments, and statistical/data analysis for process improvement.
• Proven problem-solving and analytical skills, including FMEA and root-cause investigation.
• Strong written and verbal communication skills; ability to coordinate cross-functional teams and suppliers.
• Organizational ability to manage multiple concurrent projects, schedules, and build plans.
• Preferred: extensive knowledge of package assembly technology and process flows.
• Preferred: previous semiconductor foundry or advanced packaging experience.

Education Requirements

Bachelor's degree in a natural science, engineering discipline, or related STEM field with 5+ years of industry experience, OR a Master's degree in a natural science, engineering discipline, or related STEM field with 3+ years of industry experience. Qualifications may be obtained through a combination of relevant work experience, internships, coursework, or research.

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.