Package Architecture Analyst
Intel CorporationJob Title
Package Architecture Analyst
Role Summary
As a Silicon Packaging Architect, you will design and drive end-to-end semiconductor package solutions from concept through production readiness. The role focuses on meeting electrical, mechanical, thermal, reliability, and cost requirements while ensuring manufacturability and high-quality delivery.
You will work on a cross-functional team interfacing with silicon, hardware, package, and manufacturing groups to resolve technical challenges and support tape-out and production transitions.
Experience Level
Senior — posting specifies multi-year senior experience requirements (see Education Requirements for degree/experience combinations).
Responsibilities
Primary responsibilities include defining package architecture, driving technical trade-offs, and ensuring design-to-production readiness.
- Translate product requirements into detailed package architecture specifications.
- Lead technology trade-off decisions to meet electrical, mechanical, thermal, and reliability targets.
- Collaborate with silicon, hardware, package, and manufacturing teams to remove roadblocks and deliver outputs.
- Oversee packaging development from design through production readiness and tape-out support.
- Apply Design for Manufacturing (DFM) principles to optimize designs for manufacturability and efficiency.
- Utilize Design of Experiments (DOE) methodologies to validate and refine designs.
- Troubleshoot package design and manufacturing issues and implement corrective actions.
- Maintain and refine technical documentation, processes, and procedures.
Requirements
Must-have technical skills and experience.
- Experience defining semiconductor/electronic package architectures and producing technical documentation (4+ years in relevant tasks).
- Proven application of Design for Manufacturing (DFM) principles.
- Practical use of Design of Experiments (DOE) methodologies.
- Experience diagnosing and resolving package design and manufacturing issues.
- Strong analytical, communication, and problem-solving skills; ability to influence cross-functional teams.
Nice-to-have:
- Advanced understanding of semiconductor packaging technologies and industry trends.
- Experience leading cross-disciplinary technical teams.
Education Requirements
Degree and experience combinations specified: Bachelor's degree in Mechanical Engineering, Electrical Engineering, Materials Science or a related field with 9+ years hands-on experience; or Master's in a relevant field with 6+ years hands-on experience; or PhD in a relevant field with 4+ years hands-on experience. The posting emphasizes hands-on experience in packaging design, DFM, DOE, and troubleshooting.
About the Company
Company: Intel Corporation
Headquarters: Santa Clara, California, USA
Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.
