Package and PCB Layout Engineer

Job Title

Package and PCB Layout Engineer

Role Summary

Responsible for PCB and package layout and physical design for RF hardware (e.g., WLAN, Bluetooth), working within the Silicon and Platform Engineering Group to deliver manufacturable board and package solutions.

Work includes co-design with silicon teams, defining floorplans and layouts, ensuring DRC/DFM compliance, and supporting manufacturing and assembly.

Experience Level

Mid-level / Experienced hire — 6+ years of relevant industry experience.

Responsibilities

The role owns PCB/package layout and contributes to RF hardware physical design and verification.

• Design, develop, and optimize RF hardware physical layouts, including PCB and package layout for wireless applications.
• Define floorplans, component placement, and physical design for RF circuit architectures while meeting manufacturing constraints.
• Collaborate with silicon, package, and board teams on Si–Package–Board co‑design and integration.
• Take ownership of PCB layout from placement through final outputs supporting manufacturing and assembly.
• Implement and verify design rules for substrate/PCB technologies; ensure DRC and DFM compliance.
• Support physical design debugging, signal and power integrity analysis, and circuit-level verification.

Requirements

Must-have technical skills and experience.

• 6+ years of professional experience in PCB/package layout or RF physical design.
• Proficiency with Cadence Allegro for board and package layout.
• Strong RF fundamentals, including electromagnetic theory, communication theory, and RF system analysis.
• Experience with circuit simulation tools and debugging techniques.
• Familiarity with physical-design debugging and signal/power integrity analysis methods.
• Practical knowledge of design rules, design for manufacturability (DFM), and design rule checks (DRC).

Nice-to-have:

• Experience in RF physical design for wireless products and Si–Package–Board co-design optimization.
• Familiarity with Mentor Graphics CAD tools, AutoCAD, and/or SolidWorks.
• Demonstrated problem-solving skills and experience working in cross-functional teams.
• Effective communication skills for stakeholder engagement.

Education Requirements

Bachelor's (BS) in Electrical Engineering, Mechanical Engineering, or a related field — or equivalent practical experience.

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.