Package and PCB Layout Engineer
Engineer responsible for RF hardware physical design including PCB and package layout for wireless products (e.g., WLAN, Bluetooth). Works within an RF design team to integrate silicon, package, and board-level designs and to support product manufacturability and performance targets.
This position requires on-site presence in Haifa, Israel and focuses on floorplans, layout implementation, and co-design optimization across disciplines.
Mid-level. The role requests 6+ years of relevant experience.
Primary technical and delivery responsibilities include:
Must-have skills and experience; preferred items listed as nice-to-have.
Bachelor's (BS) in Electrical Engineering, Mechanical Engineering, or a related field is listed as the minimum; the posting also allows equivalent practical experience in lieu of a degree.
Company: Intel Corporation
Headquarters: Santa Clara, California, USA
Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.
