NMSI F11X Thin Films Module Engineer-Technologist

Job Title

NMSI F11X Thin Films Module Engineer-Technologist

Role Summary

Senior technical leader in Advanced Packaging responsible for developing, optimizing, and transferring thin-film deposition processes (CVD, ALD, PVD) into high-volume manufacturing. The role partners with Technology Development, HVM, product engineering, and suppliers to improve manufacturability, yield, quality, and cost.

Experience Level

Senior-level. Typical background: Master's degree with 8+ years semiconductor experience or Bachelor's with 10+ years, with the majority focused on thin-film process engineering or related manufacturing process leadership.

Responsibilities

Drive process innovation, manufacturing readiness, and cross-functional execution for thin-film deposition technologies.

• Lead development and manufacturability of thin-film deposition processes (CVD, ALD, PVD) for advanced packaging.
• Optimize yield, defect reduction, film uniformity, throughput, and cost via systematic process improvements.
• Define and implement robust process controls and statistical process control methods.
• Lead technical problem-solving and root-cause analysis for critical manufacturing issues.
• Collaborate with tool suppliers and internal stakeholders to optimize equipment performance and tool qualification.
• Accelerate production readiness and transition technologies from TD to HVM against demanding schedules.
• Communicate technical findings to engineering teams and executive leadership; mentor technical staff.
• Participate in fab start-up activities and cross-functional product integration work.

Requirements

Key technical and professional requirements; degrees are summarized separately below.

• Extensive hands-on experience in thin-film process engineering and process development in a semiconductor environment.
• Proven success in manufacturing engineering, high-volume production support, and delivering process solutions.
• Experience working with major semiconductor equipment suppliers (e.g., AMAT, Lam, ASM, TEL) on process and equipment optimization.
• Experience with Statistical Process Control (SPC), Design of Experiments (DOE), and manufacturing automation systems.
• Demonstrated ability to solve complex technical challenges in HVM and to lead cross-functional teams.
• Experience supporting fab start-up activities and coordinating with quality, reliability, and supply chain functions.
• Preferred: experience with TSV thin-film processing and advanced packaging technologies (EMIB, Foveros, Silicon Photonics).
• Preferred: semiconductor foundry experience and demonstrated cross-functional leadership.

Education Requirements

Posting specifies either a Master’s degree in Electrical, Mechanical, Chemical Engineering, Materials Science, or related STEM field with 8+ years' semiconductor experience, or a Bachelor's in those fields with 10+ years' semiconductor experience. A Ph.D. in those fields is listed as preferred. (Fields: Electrical Engineering; Mechanical Engineering; Chemical Engineering; Materials Science; related STEM disciplines.)

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.