New College Grad - Process Integration Engineer

Job Title

New College Grad - Process Integration Engineer

Role Summary

The Process Integration (PI) engineer executes process start-up, technology transfer, yield improvement, and failure analysis for semiconductor memory manufacturing. This entry-level role works on manufacturing lines to optimize process capability, quality, and cost.

Collaborate with Technology Development, Product Engineering, and Manufacturing to validate processes, troubleshoot issues, and implement continuous improvements for next-generation devices.

Experience Level

Entry-level (New College Grad). Typically 0–2 years of relevant experience.

Responsibilities

Key responsibilities include leading investigations, improving yield and process capability, and supporting device technology transfer.

• Act as module owner for root-cause investigations and failure analysis under time constraints.
• Drive yield, cost efficiency, and quality improvements on production lines.
• Design and run DOEs to improve process capability and margin.
• Monitor process trends and sustain line stability.
• Address top detractors to improve device yield and reliability.
• Lead workshops during technology transfer for next-generation devices.
• Start up, develop, and optimize processes for product quality and reliability.
• Identify and resolve process-related issues using FMEA, 8D, SPC/FDC methodologies.
• Coordinate and execute process, equipment, and material evaluations; validate and qualify new processes, tools, and materials.
• Manage and audit material suppliers to meet quality, cost, and risk objectives; support internal and external audits.
• Be willing to travel internationally for extended tech transfer/training (3+ months) and work shifted schedules as required.

Requirements

Must-have technical skills and practical capabilities required to perform the role.

• Basic understanding of MOSFET and DRAM operation.
• Knowledge of CMOS processes and characterization methods.
• Familiarity with DOE, SPC, and JMP software.
• Ability to support SPC/FDC/RMS/APC systems and ensure site-to-site portability.
• Hands-on experience or demonstrable capability in root cause analysis and failure analysis workflows (FMEA, 8D, SPC/FDC).
• Ability to validate and qualify processes, tools, and materials and to perform supplier evaluations and audits.
• Willingness to travel internationally for multi-month assignments and to work shift schedules as required.
• Good understanding of Agentic AI or willingness to learn Agentic AI to improve workflow efficiency.

Education Requirements

Bachelor’s degree in Materials Science, Electrical, Electronics, Chemical, or a related engineering field is required. Preferred: Master’s or Ph.D. in a relevant field. Internship experience in a 300mm semiconductor environment and exposure to semiconductor/memory technologies, transistors, metallization processes, and fabrication/yield ramp are advantageous.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.