Job Title
New College Grad - Mixed Signal Design Engineer, HBM
Role Summary
Join Micron's Memory Systems Engineering team to develop digital and mixed-signal foundations for high-bandwidth memory (HBM) base die. The role focuses on micro-architecture, RTL implementation, integration with physical and system teams, and support for silicon bring-up and validation.
Experience Level
Entry-level / New college graduate. Candidates are expected to have experience from academic projects, internships, or early-career industry roles.
Responsibilities
The primary responsibilities center on digital micro-architecture, RTL development, integration, verification collaboration, and post-silicon support for HBM base-die subsystems.
- Define and implement digital micro-architecture for HBM base-die subsystems (channel support logic, boot/initialization sequencing, training orchestration, registers, telemetry, performance counters, reliability features).
- Translate system requirements into timing, power, and area constraints; maintain interface specifications for bus protocols, clock-domain crossings, and reset strategies.
- Develop and integrate synthesizable SystemVerilog RTL including multi-channel logic, interrupts, register maps, scan hooks, and DFT interfaces; support integration and ECO flows.
- Collaborate with design verification on verification planning, coverage goals, CDC/RDC checks, and debugging of RTL, testbench, and gate-level issues.
- Support silicon bring-up and post-silicon validation via debug enablement, root-cause analysis, and coordination with DFT and test teams.
- Work cross-functionally with physical layer and system architects to ensure first-pass silicon meets bandwidth, latency, power, and reliability targets.
Requirements
Key technical skills and experience expected for successful performance in this role.
Must-have:
- Experience with digital design or SoC integration through academic projects, internships, or early-career industry roles.
- Knowledge of SystemVerilog RTL development and synthesizable coding practices.
- Familiarity with clock/reset architecture, CDC/RDC methodologies, and low-power design concepts.
- Understanding of design-for-test and design-for-debug principles and ability to collaborate with cross-functional engineering teams.
- Willingness to use AI-assisted engineering tools to improve productivity, debugging, and data analysis.
Nice-to-have:
- Exposure to post-silicon validation, silicon bring-up, or structured debug workflows.
- Familiarity with scan, MBIST, LBIST, or other test and debug features.
- Experience contributing to verification plans and partnering with verification teams to achieve coverage goals.
- Interest in refining micro-architecture for timing improvements and understanding tradeoffs related to constraints and path intent.
- Experience applying AI for data analysis, debug automation, or performance optimization in semiconductor design environments.
Education Requirements
Bachelor's degree or equivalent experience in Electrical Engineering or Computer Engineering. Equivalent practical experience is explicitly acceptable.
About the Company
Company: Micron Technology
Headquarters: Boise, Idaho, USA
Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.

Date Posted: 2026-08-20